Peter G. Ledermann — 13 Patents at IBM

Peter G. Ledermann has been granted 13 US patents while listed as an inventor at IBM. The first was granted in 1989 and the most recent in August 2001. Peter G. Ledermann ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Peter G. Ledermann in Pleasantville, NY, US.

Patents per Year

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
6278784	Intermittent errors in digital disc players	—	2001-08-21
5343366	Packages for stacked integrated circuit chip cubes	Thomas M. Cipolla, Paul W. Coteus, Ioannis Damianakis, Glen Walden Johnson, Linda C. Matthew +1 more	1994-08-30	$20,418,000
5189363	Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester	Mark F. Bregman, Paul R. Hoffman, Paul A. Moskowitz, Roger A. Pollak, Timothy C. Reiley +1 more	1993-02-23	$13,775,000
5130781	Dam for lead encapsulation	Caroline A. Kovac, Luu Thanh Nguyen	1992-07-14	$13,053,000
5117457	Tamper resistant packaging for information protection in electronic circuitry	Liam D. Comerford, Lawrence I. Levy, Steve R. White	1992-05-26	$13,293,000
5065932	Solder placement nozzle with inert cover gas and inert gas bleed	Terry F. Hayden, Christopher A. Hicks, Alvin D. Nguyne, Stephen C. Steinbach, Stanley Yu	1991-11-19	$20,670,000
5042708	Solder placement nozzle assembly	Arthur L. Leerssen, Alvin D. Nguyen, Raymond E. Prime	1991-08-27	$9,455,000
5028983	Multilevel integrated circuit packaging structures	Harry R. Bickford, Mark F. Bregman, Thomas M. Cipolla, John Gow, 3rd, Ekkehard F. Miersch +5 more	1991-07-02	$16,319,000
4970579	Integrated circuit package with improved cooling means	Brian D. Arldt, Peter H. Bruhn, M. Lawrence Buller, Stephen D. Linam, Barbara J. McNelis +2 more	1990-11-13	$12,818,000
4934309	Solder deposition system	Luu Thanh Nguyen	1990-06-19	$26,220,000
4898117	Solder deposition system	Luu Thanh Nguyen	1990-02-06	$16,892,000
4881885	Dam for lead encapsulation	Caroline A. Kovac, Luu Thanh Nguyen	1989-11-21	$19,383,000
4814855	Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape	Rodney T. Hodgson, Harry J. Jones, Timothy C. Reiley, Paul A. Moskowitz	1989-03-21	$15,511,000

Peter G. Ledermann — 13 Patents

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