Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6278784 | Intermittent errors in digital disc players | — | 2001-08-21 |
| 5343366 | Packages for stacked integrated circuit chip cubes | Thomas M. Cipolla, Paul W. Coteus, Ioannis Damianakis, Glen Walden Johnson, Linda C. Matthew +1 more | 1994-08-30 |
| 5189363 | Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester | Mark F. Bregman, Paul R. Hoffman, Paul A. Moskowitz, Roger A. Pollak, Timothy C. Reiley +1 more | 1993-02-23 |
| 5130781 | Dam for lead encapsulation | Caroline A. Kovac, Luu Thanh Nguyen | 1992-07-14 |
| 5117457 | Tamper resistant packaging for information protection in electronic circuitry | Liam D. Comerford, Lawrence I. Levy, Steve R. White | 1992-05-26 |
| 5065932 | Solder placement nozzle with inert cover gas and inert gas bleed | Terry F. Hayden, Christopher A. Hicks, Alvin D. Nguyne, Stephen C. Steinbach, Stanley Yu | 1991-11-19 |
| 5042708 | Solder placement nozzle assembly | Arthur L. Leerssen, Alvin D. Nguyen, Raymond E. Prime | 1991-08-27 |
| 5028983 | Multilevel integrated circuit packaging structures | Harry R. Bickford, Mark F. Bregman, Thomas M. Cipolla, John Gow, 3rd, Ekkehard F. Miersch +5 more | 1991-07-02 |
| 4970579 | Integrated circuit package with improved cooling means | Brian D. Arldt, Peter H. Bruhn, M. Lawrence Buller, Stephen D. Linam, Barbara J. McNelis +2 more | 1990-11-13 |
| 4934309 | Solder deposition system | Luu Thanh Nguyen | 1990-06-19 |
| 4898117 | Solder deposition system | Luu Thanh Nguyen | 1990-02-06 |
| 4881885 | Dam for lead encapsulation | Caroline A. Kovac, Luu Thanh Nguyen | 1989-11-21 |
| 4814855 | Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape | Rodney T. Hodgson, Harry J. Jones, Timothy C. Reiley, Paul A. Moskowitz | 1989-03-21 |