| 6278784 |
Intermittent errors in digital disc players |
— |
2001-08-21 |
| 5343366 |
Packages for stacked integrated circuit chip cubes |
Thomas M. Cipolla, Paul W. Coteus, Ioannis Damianakis, Glen Walden Johnson, Linda C. Matthew +1 more |
1994-08-30 |
| 5189363 |
Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester |
Mark F. Bregman, Paul R. Hoffman, Paul A. Moskowitz, Roger A. Pollak, Timothy C. Reiley +1 more |
1993-02-23 |
| 5130781 |
Dam for lead encapsulation |
Caroline A. Kovac, Luu Thanh Nguyen |
1992-07-14 |
| 5117457 |
Tamper resistant packaging for information protection in electronic circuitry |
Liam D. Comerford, Lawrence I. Levy, Steve R. White |
1992-05-26 |
| 5065932 |
Solder placement nozzle with inert cover gas and inert gas bleed |
Terry F. Hayden, Christopher A. Hicks, Alvin D. Nguyne, Stephen C. Steinbach, Stanley Yu |
1991-11-19 |
| 5042708 |
Solder placement nozzle assembly |
Arthur L. Leerssen, Alvin D. Nguyen, Raymond E. Prime |
1991-08-27 |
| 5028983 |
Multilevel integrated circuit packaging structures |
Harry R. Bickford, Mark F. Bregman, Thomas M. Cipolla, John Gow, 3rd, Ekkehard F. Miersch +5 more |
1991-07-02 |
| 4970579 |
Integrated circuit package with improved cooling means |
Brian D. Arldt, Peter H. Bruhn, M. Lawrence Buller, Stephen D. Linam, Barbara J. McNelis +2 more |
1990-11-13 |
| 4934309 |
Solder deposition system |
Luu Thanh Nguyen |
1990-06-19 |
| 4898117 |
Solder deposition system |
Luu Thanh Nguyen |
1990-02-06 |
| 4881885 |
Dam for lead encapsulation |
Caroline A. Kovac, Luu Thanh Nguyen |
1989-11-21 |
| 4814855 |
Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape |
Rodney T. Hodgson, Harry J. Jones, Timothy C. Reiley, Paul A. Moskowitz |
1989-03-21 |
