RP

Raymond E. Prime

IBM: 1 patents #44,794 of 70,183Top 65%
Overall (All Time): #3,883,774 of 4,157,543Top 95%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5042708 Solder placement nozzle assembly Peter G. Ledermann, Arthur L. Leerssen, Alvin D. Nguyen 1991-08-27