Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6403892 | Coated means for connecting a chip and a card | Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus +5 more | 2002-06-11 |
| 5874154 | Structure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive pattern | Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich +4 more | 1999-02-23 |
| 5800858 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich +4 more | 1998-09-01 |
| 5730890 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Harry R. Bickford, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich, Stephen L. Tisdale +1 more | 1998-03-24 |
| 5709906 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich +4 more | 1998-01-20 |
| 5546655 | Method of applying flex tape protective coating onto a flex product | Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus +5 more | 1996-08-20 |
| 5480841 | Process of multilayer conductor chip packaging | Harry R. Bickford, Paul W. Coteus | 1996-01-02 |
| 5462628 | Method for bonding two surfaces together | Alfred Viehbeck, Martin J. Goldberg, Stephen L. Tisdale, Stephen L. Buchwalter, Kurt R. Grebe +1 more | 1995-10-31 |
| 5399902 | Semiconductor chip packaging structure including a ground plane | Harry R. Bickford, Paul W. Coteus | 1995-03-21 |
| 5374454 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich +4 more | 1994-12-20 |
| 5360946 | Flex tape protective coating | Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus +5 more | 1994-11-01 |
| 5343366 | Packages for stacked integrated circuit chip cubes | Thomas M. Cipolla, Paul W. Coteus, Ioannis Damianakis, Glen Walden Johnson, Peter G. Ledermann +1 more | 1994-08-30 |
| 5268815 | High density, high performance memory circuit package | Thomas M. Cipolla, Paul W. Coteus, Brian C. Derdall, Christina M. Knoedler, Alphonso P. Lanzetta +3 more | 1993-12-07 |
| 5242713 | Method for conditioning an organic polymeric material | Alfred Viehbeck, Stephen L. Buchwalter, William A. Donson, John J. Glenning, Martin J. Goldberg +6 more | 1993-09-07 |
| 5203955 | Method for etching an organic polymeric material | Aldred Viehbeck, Stephen L. Buchwalter, John J. Glenning, Martin J. Goldberg, Caroline A. Kovac +2 more | 1993-04-20 |
| 5074969 | Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate | William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer +2 more | 1991-12-24 |
| 5038195 | Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate | William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer +2 more | 1991-08-06 |