Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4814855 | Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape | Rodney T. Hodgson, Peter G. Ledermann, Timothy C. Reiley, Paul A. Moskowitz | 1989-03-21 |
| 4746815 | Electronic EC for minimizing EC pads | Harsaran S. Bhatia, Mario E. Ecker, Shashi D. Malaviya | 1988-05-24 |
| 4743781 | Dotting circuit with inhibit function | Harsaran S. Bhatia, Shashi D. Malaviya | 1988-05-10 |
| 4358890 | Process for making a dual implanted drain extension for bucket brigade device tetrode structure | Lawrence G. Heller, Harish N. Kotecha, Donald A. Soderman | 1982-11-16 |