Mario E. Ecker — 15 Patents at IBM

Mario E. Ecker has been granted 15 US patents while listed as an inventor at IBM. The first was granted in 1981 and the most recent in December 1998. Mario E. Ecker ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Mario E. Ecker in Poughkeepsie, NY, US.

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
5842881	Substrate-embedded pluggable receptacles for connecting clustered electrical cables to a module	Lawrence Jacobowitz, Casimer M. DeCusatis	1998-12-01	$29,316,000
5541005	Large ceramic article and method of manufacturing	Raschid J. Bezama, Jon A. Casey, Shaji Farooq, Irene S. Frantz, Katherine G. Frase +12 more	1996-07-30	$12,111,000
5439636	Large ceramic articles and method of manufacturing	Raschid J. Bezama, Jon A. Casey, Shaji Farooq, Irene S. Frantz, Katharine G. Frase +12 more	1995-08-08	$12,123,000
5396573	Pluggable connectors for connecting large numbers of electrical and/or optical cables to a module through a seal	Lawrence Jacobowitz, Casimer M. DeCusatis	1995-03-07	$9,667,000
5337388	Matrix of pluggable connectors for connecting large numbers of clustered electrical and/or opticcal cables to a module	Lawrence Jacobowitz, Casimer M. DeCusatis	1994-08-09	$14,741,000
5333225	Substrate-embedded pluggable receptacles for connecting clustered optical cables to a module	Lawrence Jacobowitz, Casimer M. DeCusatis	1994-07-26	$10,324,000
5304969	Apparatus and a method for an electrical transmission-line interface	Lawrence Jacobowitz	1994-04-19	$9,041,000
5241614	Apparatus and a method for an optical fiber interface	Lawrence Jacobowitz	1993-08-31	$6,793,000
5173668	Apparatus and a method for an electrical transmission-line interface	Lawrence Jacobowitz	1992-12-22	$13,419,000
5155786	Apparatus and a method for an optical fiber interface	Lawrence Jacobowitz	1992-10-13	$5,658,000
4785135	De-coupled printed circuits	Leonard T. Olson	1988-11-15	$15,502,000
4746815	Electronic EC for minimizing EC pads	Harsaran S. Bhatia, Harry J. Jones, Shashi D. Malaviya	1988-05-24	$27,575,000
4549200	Repairable multi-level overlay system for semiconductor device	Leonard T. Olson	1985-10-22	$20,916,000
4377316	High density interconnection means for chip carriers	Leonard T. Olson	1983-03-22	$24,499,000
4251852	Integrated circuit package	Leonard T. Olson	1981-02-17	$13,168,000

Mario E. Ecker — 15 Patents

Issued Patents All Time

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