| 5200631 |
High speed optical interconnect |
Francis D. Austin, Richard Kachmarik |
1993-04-06 |
| 5028983 |
Multilevel integrated circuit packaging structures |
Harry R. Bickford, Mark F. Bregman, Thomas M. Cipolla, John Gow, 3rd, Peter G. Ledermann +5 more |
1991-07-02 |
| 5005939 |
Optoelectronic assembly |
Nicolaos C. Arvanitakis, Vincent J. Black, Richard Corley, Richard G. Nolan |
1991-04-09 |
| 4945399 |
Electronic package with integrated distributed decoupling capacitors |
Michael Benjamin Brown, William S. Ebert, Richard R. Sloma |
1990-07-31 |
| 4916259 |
Composite dielectric structure for optimizing electrical performance in high performance chip support packages |
Ronald S. Charsky, David P. Pagnani |
1990-04-10 |
| 4785135 |
De-coupled printed circuits |
Mario E. Ecker |
1988-11-15 |
| 4744008 |
Flexible film chip carrier with decoupling capacitors |
Vincent J. Black, Ronald S. Charsky |
1988-05-10 |
| 4549200 |
Repairable multi-level overlay system for semiconductor device |
Mario E. Ecker |
1985-10-22 |
| 4377316 |
High density interconnection means for chip carriers |
Mario E. Ecker |
1983-03-22 |
| 4251852 |
Integrated circuit package |
Mario E. Ecker |
1981-02-17 |
