Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9018089 | Multiple step anneal method and semiconductor formed by multiple step anneal | Eric G. Liniger, Griselda Bonilla, Stephen A. Cohen, Stephen M. Gates, Thomas M. Shaw | 2015-04-28 |
| 8378493 | Generation of metal holes by via mutation | Robert C. Wong, Ernst Demm, Alexander Hirsch | 2013-02-19 |
| 7875544 | Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation | Robert C. Wong, Ernst Demm, Alexander Hirsch | 2011-01-25 |
| 7790601 | Forming interconnects with air gaps | Samuel S. Choi, Lawrence A. Clevenger, Maxime Darnon, Daniel C. Edelstein, Satyanarayana V. Nitta +1 more | 2010-09-07 |
| 7188321 | Generation of metal holes by via mutation | Robert C. Wong, Ernst Demm, Alexander Hirsch | 2007-03-06 |
| D369163 | Telephone set | Daniel C. F. Leung | 1996-04-23 |