Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319870 | Photovoltaic module with a controllable infrared protection layer | Lawrence A. Clevenger, Timothy J. Dalton, Rainer Krause, Gerd Pfeiffer, Kevin M. Prettyman +2 more | 2019-06-11 |
| 10056266 | Method for manufacturing a resistive device for a memory or logic circuit | Bernard Dieny, Gabriele Navarro, Olivier Joubert | 2018-08-21 |
| 9123652 | Multi-level autolimitating etching method | Olivier Desplats, Thierry Chevolleau, Cecile Gourgon | 2015-09-01 |
| 9059249 | Interconnect structures containing a photo-patternable low-k dielectric with a curved sidewall surface | Qinghuang Lin | 2015-06-16 |
| 8956886 | Embedded test structure for trimming process control | Samer Banna, Olivier Joubert, Lei Lian, Nicolas Posseme, Laurent Vallier | 2015-02-17 |
| 8952539 | Methods for fabrication of an air gap-containing interconnect structure | Lawrence A. Clevenger, Satyanarayana V. Nitta, Anthony D. Lisi, Qinghuang Lin | 2015-02-10 |
| 8896120 | Structures and methods for air gap integration | Lawrence A. Clevenger, Qinghuang Lin, Anthony D. Lisi, Satyanarayana V. Nitta | 2014-11-25 |
| 8853856 | Methodology for evaluation of electrical characteristics of carbon nanotubes | Gerald W. Gibson, Pratik P. Joshi, Qinghuang Lin | 2014-10-07 |
| 8828749 | Methodology for evaluation of electrical characteristics of carbon nanotubes | Gerald W. Gibson, Pratik P. Joshi, Qinghuang Lin | 2014-09-09 |
| 8642252 | Methods for fabrication of an air gap-containing interconnect structure | Lawrence A. Clevenger, Satyanarayana V. Nitta, Anthony D. Lisi, Qinghuang Lin | 2014-02-04 |
| 8637395 | Methods for photo-patternable low-k (PPLK) integration with curing after pattern transfer | Qinghuang Lin | 2014-01-28 |
| 8629561 | Air gap-containing interconnect structure having photo-patternable low k material | Lawrence A. Clevenger, Qinghuang Lin, Anthony D. Lisi, Satyanarayana V. Nitta | 2014-01-14 |
| 8546263 | Method of patterning of magnetic tunnel junctions | Olivier Joubert, Benjamin Schwarz, Jérémy Gilbert Maurice Pereira, Kevin Menguelti, Erwine Maude Pargon | 2013-10-01 |
| 8475667 | Method of patterning photosensitive material on a substrate containing a latent acid generator | Pratik P. Joshi, Qinghuang Lin | 2013-07-02 |
| 8449781 | Selective etch back process for carbon nanotubes intergration | Gerald W. Gibson, Pratik P. Joshi, Ryan M. Martin, Ying Zhang | 2013-05-28 |
| 8298937 | Interconnect structure fabricated without dry plasma etch processing | Jeffrey P. Gambino, Elbert E. Huang, Qinghuang Lin | 2012-10-30 |
| 8241992 | Method for air gap interconnect integration using photo-patternable low k material | Lawrence A. Clevenger, Qinghuang Lin, Anthony D. Lisi, Satyanarayana V. Nitta | 2012-08-14 |
| 8183694 | Reversing tone of patterns on integrated circuit and nanoscale fabrication | Lawrence A. Clevenger, Anthony D. Lisi, Satya V. Nitta | 2012-05-22 |
| 7939446 | Process for reversing tone of patterns on integerated circuit and structural process for nanoscale fabrication | Lawrence A. Clevenger, Anthony D. Lisi, Satya V. Nitta | 2011-05-10 |
| 7790601 | Forming interconnects with air gaps | Samuel S. Choi, Lawrence A. Clevenger, Daniel C. Edelstein, Satyanarayana V. Nitta, Shom Ponoth +1 more | 2010-09-07 |