| 10319870 |
Photovoltaic module with a controllable infrared protection layer |
Lawrence A. Clevenger, Timothy J. Dalton, Rainer Krause, Gerd Pfeiffer, Kevin M. Prettyman +2 more |
2019-06-11 |
$1,829,000 |
| 10056266 |
Method for manufacturing a resistive device for a memory or logic circuit |
Bernard Dieny, Gabriele Navarro, Olivier Joubert |
2018-08-21 |
|
| 9123652 |
Multi-level autolimitating etching method |
Olivier Desplats, Thierry Chevolleau, Cecile Gourgon |
2015-09-01 |
|
| 9059249 |
Interconnect structures containing a photo-patternable low-k dielectric with a curved sidewall surface |
Qinghuang Lin |
2015-06-16 |
$2,098,000 |
| 8956886 |
Embedded test structure for trimming process control |
Samer Banna, Olivier Joubert, Lei Lian, Nicolas Posseme, Laurent Vallier |
2015-02-17 |
$27,626,000 |
| 8952539 |
Methods for fabrication of an air gap-containing interconnect structure |
Lawrence A. Clevenger, Satyanarayana V. Nitta, Anthony D. Lisi, Qinghuang Lin |
2015-02-10 |
$3,717,000 |
| 8896120 |
Structures and methods for air gap integration |
Lawrence A. Clevenger, Qinghuang Lin, Anthony D. Lisi, Satyanarayana V. Nitta |
2014-11-25 |
$4,405,000 |
| 8853856 |
Methodology for evaluation of electrical characteristics of carbon nanotubes |
Gerald W. Gibson, Pratik P. Joshi, Qinghuang Lin |
2014-10-07 |
$3,450,000 |
| 8828749 |
Methodology for evaluation of electrical characteristics of carbon nanotubes |
Gerald W. Gibson, Pratik P. Joshi, Qinghuang Lin |
2014-09-09 |
$5,167,000 |
| 8642252 |
Methods for fabrication of an air gap-containing interconnect structure |
Lawrence A. Clevenger, Satyanarayana V. Nitta, Anthony D. Lisi, Qinghuang Lin |
2014-02-04 |
$4,435,000 |
| 8637395 |
Methods for photo-patternable low-k (PPLK) integration with curing after pattern transfer |
Qinghuang Lin |
2014-01-28 |
$3,630,000 |
| 8629561 |
Air gap-containing interconnect structure having photo-patternable low k material |
Lawrence A. Clevenger, Qinghuang Lin, Anthony D. Lisi, Satyanarayana V. Nitta |
2014-01-14 |
$7,408,000 |
| 8546263 |
Method of patterning of magnetic tunnel junctions |
Olivier Joubert, Benjamin Schwarz, Jérémy Gilbert Maurice Pereira, Kevin Menguelti, Erwine Maude Pargon |
2013-10-01 |
$12,396,000 |
| 8475667 |
Method of patterning photosensitive material on a substrate containing a latent acid generator |
Pratik P. Joshi, Qinghuang Lin |
2013-07-02 |
$6,261,000 |
| 8449781 |
Selective etch back process for carbon nanotubes intergration |
Gerald W. Gibson, Pratik P. Joshi, Ryan M. Martin, Ying Zhang |
2013-05-28 |
$7,454,000 |
| 8298937 |
Interconnect structure fabricated without dry plasma etch processing |
Jeffrey P. Gambino, Elbert E. Huang, Qinghuang Lin |
2012-10-30 |
|
| 8241992 |
Method for air gap interconnect integration using photo-patternable low k material |
Lawrence A. Clevenger, Qinghuang Lin, Anthony D. Lisi, Satyanarayana V. Nitta |
2012-08-14 |
$4,482,000 |
| 8183694 |
Reversing tone of patterns on integrated circuit and nanoscale fabrication |
Lawrence A. Clevenger, Anthony D. Lisi, Satya V. Nitta |
2012-05-22 |
$8,891,000 |
| 7939446 |
Process for reversing tone of patterns on integerated circuit and structural process for nanoscale fabrication |
Lawrence A. Clevenger, Anthony D. Lisi, Satya V. Nitta |
2011-05-10 |
$6,699,000 |
| 7790601 |
Forming interconnects with air gaps |
Samuel S. Choi, Lawrence A. Clevenger, Daniel C. Edelstein, Satyanarayana V. Nitta, Shom Ponoth +1 more |
2010-09-07 |
$2,081,000 |
