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Methods for fabrication of an air gap-containing interconnect structure |
Lawrence A. Clevenger, Maxime Darnon, Satyanarayana V. Nitta, Qinghuang Lin |
2015-02-10 |
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Structures and methods for air gap integration |
Lawrence A. Clevenger, Maxime Darnon, Qinghuang Lin, Satyanarayana V. Nitta |
2014-11-25 |
| 8642252 |
Methods for fabrication of an air gap-containing interconnect structure |
Lawrence A. Clevenger, Maxime Darnon, Satyanarayana V. Nitta, Qinghuang Lin |
2014-02-04 |
| 8629561 |
Air gap-containing interconnect structure having photo-patternable low k material |
Lawrence A. Clevenger, Maxime Darnon, Qinghuang Lin, Satyanarayana V. Nitta |
2014-01-14 |
| 8399180 |
Three dimensional integration with through silicon vias having multiple diameters |
Mukta G. Farooq, Ramona Kei, Emily R. Kinser, Richard S. Wise, Hakeem Yusuff |
2013-03-19 |
| 8241992 |
Method for air gap interconnect integration using photo-patternable low k material |
Lawrence A. Clevenger, Maxime Darnon, Qinghuang Lin, Satyanarayana V. Nitta |
2012-08-14 |
| 8183694 |
Reversing tone of patterns on integrated circuit and nanoscale fabrication |
Lawrence A. Clevenger, Maxime Darnon, Satya V. Nitta |
2012-05-22 |
| 8058176 |
Methods of patterning insulating layers using etching techniques that compensate for etch rate variations |
Wan Jae Park, Kaushik A. Kumar, Joseph Edward Linville, Ravi Prakash Srivastava, Hermann Wendt |
2011-11-15 |
| 7943480 |
Sub-lithographic dimensioned air gap formation and related structure |
Daniel C. Edelstein, Nicholas C. M. Fuller, David V. Horak, Elbert E. Huang, Wai-Kin Li +2 more |
2011-05-17 |
| 7939446 |
Process for reversing tone of patterns on integerated circuit and structural process for nanoscale fabrication |
Lawrence A. Clevenger, Maxime Darnon, Satya V. Nitta |
2011-05-10 |
| 7470616 |
Damascene wiring fabrication methods incorporating dielectric cap etch process with hard mask retention |
Hakeem S. B. Akinmade-Yusuff, Kaushik A. Kumar |
2008-12-30 |
