Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12276831 | Enlarged multilayer nitride waveguide for photonic integrated circuit | Shesh Mani Pandey, Yusheng Bian | 2025-04-15 |
| 11417525 | Multiple patterning with mandrel cuts defined by block masks | Martin O'Toole, Keith Donegan, Brendan O'Brien, Hsueh-Chung Chen, Terry A. Spooner +4 more | 2022-08-16 |
| 11398378 | Metal on metal multiple patterning | Hsueh-Chung Chen, Somnath Ghosh, Nicholas V. LiCausi, Terry A. Spooner, Sean Reidy | 2022-07-26 |
| 10833022 | Structure and method to improve overlay performance in semiconductor devices | Cung D. Tran, Huaxiang Li, Bradley Morgenfeld, Xintuo Dai, Sanggil Bae +7 more | 2020-11-10 |
| 10818494 | Metal on metal multiple patterning | Hsueh-Chung Chen, Somnath Ghosh, Nicholas V. LiCausi, Terry A. Spooner, Sean Reidy | 2020-10-27 |
| 10818557 | Integrated circuit structure to reduce soft-fail incidence and method of forming same | Sipeng Gu, Akshey Sehgal, Xinyuan Dou, Sunil Kumar Singh, Haiting Wang +1 more | 2020-10-27 |
| 10784119 | Multiple patterning with lithographically-defined cuts | Hsueh-Chung Chen, Steven McDermott, Martin O'Toole, Brendan O'Brien, Terry A. Spooner | 2020-09-22 |
| 10770344 | Chamferless interconnect vias of semiconductor devices | Yuping Ren, Haigou Huang, Zhiguo Sun, Qiang Fang, Cheng Xu +1 more | 2020-09-08 |
| 10714380 | Method of forming smooth sidewall structures using spacer materials | Sipeng Gu, Sunil Kumar Singh, Xinyuan Dou, Akshey Sehgal, Zhiguo Sun | 2020-07-14 |
| 10692812 | Interconnects with variable space mandrel cuts formed by block patterning | Hui Zang, Jiehui Shu | 2020-06-23 |
| 10504851 | Structure and method to improve overlay performance in semiconductor devices | Cung D. Tran, Huaxiang Li, Bradley Morgenfeld, Xintuo Dai, Sanggil Bae +7 more | 2019-12-10 |
| 10504774 | Lithographic patterning to form fine pitch features | Sunil Kumar Singh, Sohan S. Mehta, SherJang Singh | 2019-12-10 |
| 10497610 | Dual photoresist approach to lithographic patterning for pitch reduction | Sunil Kumar Singh | 2019-12-03 |
| 10395941 | SADP method with mandrel undercut spacer portion for mandrel space dimension control | Hsueh-Chung Chen | 2019-08-27 |
| 10347528 | Interconnect formation process using wire trench etch prior to via etch, and related interconnect | Sunil Kumar Singh, Sipeng Gu, Akshey Sehgal | 2019-07-09 |
| 10312188 | Interconnect structure with method of forming the same | Sunil Kumar Singh | 2019-06-04 |
| 10192780 | Self-aligned multiple patterning processes using bi-layer mandrels and cuts formed with block masks | Xiaohan Wang, Jiehui Shu, Brendan O'Brien, Terry A. Spooner, Jinping Liu | 2019-01-29 |
| 9691654 | Methods and devices for back end of line via formation | Sunil Kumar Singh, Sohan S. Mehta | 2017-06-27 |
| 9613909 | Methods and devices for metal filling processes | Sunil Kumar Singh, Nicholas Robert STOKES | 2017-04-04 |
| 9576894 | Integrated circuits including organic interlayer dielectric layers and methods for fabricating the same | Sunil Kumar Singh, Xusheng Wu, Akshey Sehgal, Teck Jung Tang | 2017-02-21 |
| 9362162 | Methods of fabricating BEOL interlayer structures | Sunil Kumar Singh, Teck Jung Tang, Mark A. Zaleski | 2016-06-07 |
| 9293363 | Methods and structures for back end of line integration | Sunil Kumar Singh, Mark A. Zaleski, Akshey Sehgal | 2016-03-22 |
| 9117822 | Methods and structures for back end of line integration | Sunil Kumar Singh, Mark A. Zaleski, Akshey Sehgal | 2015-08-25 |
| 8932961 | Critical dimension and pattern recognition structures for devices manufactured using double patterning techniques | Sohan S. Mehta, Tong Qing Chen, Vikrant Chauhan, Catherine B. Labelle, Mark Kelling | 2015-01-13 |
| 8822342 | Method to reduce depth delta between dense and wide features in dual damascene structures | Oluwafemi. O. Ogunsola, Craig Child, Muhammed Shafi Pallachalil, Habib Hichri, Matthew S. Angyal +1 more | 2014-09-02 |