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Interconnect structures of semiconductor devices having a via structure through an upper conductive line |
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2022-07-05 |
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Gunter Grasshoff |
2019-02-05 |
| 9911619 |
Fin cut with alternating two color fin hardmask |
Ruilong Xie, Hoon Kim, Lars Liebmann, Chanro Park, Min Gyu Sung |
2018-03-06 |
| 9881842 |
Wimpy and nominal semiconductor device structures for vertical finFETs |
Kisup Chung, Su Chen Fan, Xin Miao |
2018-01-30 |
| 9875905 |
FinFET devices having fins with a tapered configuration and methods of fabricating the same |
Min Gyu Sung, Ruilong Xie |
2018-01-23 |
| 9837268 |
Raised fin structures and methods of fabrication |
Yi Qi, Xunyuan Zhang |
2017-12-05 |
| 9779960 |
Hybrid fin cutting processes for FinFET semiconductor devices |
Ruilong Xie, Min Gyu Sung |
2017-10-03 |
| 9761495 |
Methods of performing concurrent fin and gate cut etch processes for FinFET semiconductor devices and the resulting devices |
Ruilong Xie, Min Gyu Sung, Chanro Park, Hoon Kim |
2017-09-12 |
| 9722024 |
Formation of semiconductor structures employing selective removal of fins |
Ruilong Xie, Min Gyu Sung |
2017-08-01 |
| 9548249 |
Methods of performing fin cut etch processes for FinFET semiconductor devices and the resulting devices |
Min Gyu Sung |
2017-01-17 |
| 9431539 |
Dual-strained nanowire and FinFET devices with dielectric isolation |
Yi Qi, Xiuyu Cai |
2016-08-30 |
| 9391140 |
Raised fin structures and methods of fabrication |
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2016-07-12 |
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Methods of forming gate structures for semiconductor devices using a replacement gate technique and the resulting devices |
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2015-11-10 |
| 9064848 |
ARC residue-free etching |
Xiang Hu, Richard Wise, Habib Hichri |
2015-06-23 |
| 8932961 |
Critical dimension and pattern recognition structures for devices manufactured using double patterning techniques |
Sohan S. Mehta, Tong Qing Chen, Vikrant Chauhan, Ravi Prakash Srivastava, Mark Kelling |
2015-01-13 |
| 8901006 |
ARC residue-free etching |
Xiang Hu, Richard Wise, Habib Hichri |
2014-12-02 |
| 8525234 |
Formation of FinFET gate spacer |
Douglas J. Bonser |
2013-09-03 |
| 8448103 |
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John C. Arnold |
2013-05-21 |
| 8174055 |
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Douglas J. Bonser |
2012-05-08 |
| 7049209 |
De-fluorination of wafer surface and related structure |
Timothy J. Dalton, Nicholas Fuller, Kaushik A. Kumar |
2006-05-23 |
| 6982043 |
Scatterometry with grating to observe resist removal rate during etch |
Ramkumar Subramanian, Bharath Rangarajan, Bhanwar Singh, Christopher F. Lyons |
2006-01-03 |
| 6793765 |
Situ monitoring of microloading using scatterometry with variable pitch gratings |
Bhanwar Singh, Bharath Rangarajan |
2004-09-21 |
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Effect of substrate surface treatment on 193 NM resist processing |
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2004-06-08 |