Issued Patents All Time
Showing 25 most recent of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12150393 | Heater for phase change material memory cell | Victor Chan, Jin-Ping Han, Injo Ok | 2024-11-19 |
| 11908944 | Contact formation for vertical field effect transistors | Heng Wu, Lan Yu, Ruilong Xie | 2024-02-20 |
| 10832946 | Recessed interconnet line having a low-oxygen cap for facilitating a robust planarization process and protecting the interconnect line from downstream etch operations | Hari Prasad Amanapu | 2020-11-10 |
| 10256186 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2019-04-09 |
| 10224236 | Forming air gap | Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Griselda Bonilla, Andrew H. Simon | 2019-03-05 |
| 10186482 | Self aligned via fuse | Junjing Bao, Wai-Kin Li | 2019-01-22 |
| 10177031 | Subtractive etch interconnects | Junjing Bao, Griselda Bonilla, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2019-01-08 |
| 10103068 | Detecting a void between a via and a wiring line | Griselda Bonilla, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2018-10-16 |
| 9893011 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow +3 more | 2018-02-13 |
| 9852980 | Interconnect structure having substractive etch feature and damascene feature | Griselda Bonilla, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-12-26 |
| 9755016 | Integration process to form microelectronic or micromechanical structures | Wai-Kin Li | 2017-09-05 |
| 9685404 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow +3 more | 2017-06-20 |
| 9601426 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-03-21 |
| 9536830 | High performance refractory metal / copper interconnects to eliminate electromigration | Junjing Bao, Griselda Bonilla, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2017-01-03 |
| 9536842 | Structure with air gap crack stop | Junjing Bao, Griselda Bonilla, Ronald G. Filippi, Xiao Hu Liu, Naftali E. Lustig +1 more | 2017-01-03 |
| 9502350 | Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer | Griselda Bonilla, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2016-11-22 |
| 9455186 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Griselda Bonilla, James A. Culp, Thomas W. Dyer +4 more | 2016-09-27 |
| 9431292 | Alternate dual damascene method for forming interconnects | Griselda Bonilla, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2016-08-30 |
| 9431346 | Graphene-metal E-fuse | Junjing Bao, Griselda Bonilla, Ronald G. Filippi, Andrew Tae Kim, Naftali E. Lustig +1 more | 2016-08-30 |
| 9425144 | Metal fuse structure for improved programming capability | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +2 more | 2016-08-23 |
| 9406560 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Griselda Bonilla, James A. Culp, Thomas W. Dyer +4 more | 2016-08-02 |
| 9385038 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Griselda Bonilla, James A. Culp, Thomas W. Dyer +4 more | 2016-07-05 |
| 9324655 | Modified via bottom for beol via efuse | Junjing Bao, Griselda Bonilla, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2016-04-26 |
| 9324635 | Semiconductor interconnect structure having a graphene-based barrier metal layer | Junjing Bao, Xuesong Li, Shaoning Yao | 2016-04-26 |
| 9324634 | Semiconductor interconnect structure having a graphene-based barrier metal layer | Junjing Bao, Shaoning Yao, Xuesong Li | 2016-04-26 |