Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8536685 | Shielded semiconductor device structure | Jagdish Prasad | 2013-09-17 |
| 8129266 | Method of forming a shielded semiconductor device and structure therefor | Jagdish Prasad | 2012-03-06 |
| 7947592 | Thick metal interconnect with metal pad caps at selective sites and process for making the same | Jagdish Prasad, Hocine Bouzid Ziad | 2011-05-24 |
| 7800239 | Thick metal interconnect with metal pad caps at selective sites and process for making the same | Jagdish Prasad, Hocine Bouzid Ziad | 2010-09-21 |
| 7163883 | Edge seal for a semiconductor device | Birendra Agarwala, Eric G. Liniger, Diana Llera-Hurlburt, Du Nguyen, Richard W. Procter +3 more | 2007-01-16 |
| 6972209 | Stacked via-stud with improved reliability in copper metallurgy | Birendra Agarwala, Conrad A. Barile, Brett H. Engle, Michael Lane, Ernest N. Levine +8 more | 2005-12-06 |
| 6734090 | Method of making an edge seal for a semiconductor device | Birendra Agarwala, Eric G. Liniger, Diana Llera-Hurlburt, Du Nguyen, Richard W. Procter +3 more | 2004-05-11 |
| 6618267 | Multi-level electronic package and method for making same | Gene J. Gaudenzi | 2003-09-09 |
| 6597067 | Self-aligned, lateral diffusion barrier in metal lines to eliminate electromigration | Glenn A. Biery, Daniel M. Boyne, H. Daniel Schnurmann | 2003-07-22 |
| 6348731 | Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same | Leon Ashley, Du Nguyen, Hazara S. Rathore, Richard G. Smith | 2002-02-19 |
| 6344234 | Method for forming reflowed solder ball with low melting point metal cap | Alexis Bitaillou, Kenneth Michael Fallon, Gene J. Gaudenzi, Kenneth Robert Herman, Frederic Pierre +1 more | 2002-02-05 |
| 6336262 | Process of forming a capacitor with multi-level interconnection technology | Gene J. Gaudenzi, Rebecca Y. Gorrell, Mark A. Takacs, Kenneth J. Travis, Jr. | 2002-01-08 |
| 6323554 | Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD | Rajiv V. Joshi, Jerome J. Cuomo, Louis L. Hsu | 2001-11-27 |
| 6294835 | Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof | Du Nguyen, Hazara S. Rathore | 2001-09-25 |
| 6287954 | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity | Leon Ashley, Du Nguyen, Hazara S. Rathore, Richard G. Smith | 2001-09-11 |
| 6259159 | Reflowed solder ball with low melting point metal cap | Alexis Bitaillou, Kenneth Michael Fallon, Gene Jospeh Gaudenzi, Kenneth Robert Herman, Frederic Pierre +1 more | 2001-07-10 |
| 6258710 | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity | Hazara S. Rathore, Paul S. McLaughlin, Du Nguyen, Richard G. Smith, Alexander J. Swinton +1 more | 2001-07-10 |
| 6203926 | Corrosion-free multi-layer conductor | Umar M. Ahmad, Harsaran S. Bhatia, Satya Pal Singh Bhatia, William H. Price, Sampath Purushothaman | 2001-03-20 |
| 6147402 | Refractory metal capped low resistivity metal conductor lines and vias | Rajiv V. Joshi, Jerome J. Cuomo, Louis L. Hsu | 2000-11-14 |
| 6133139 | Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof | Du Nguyen, Hazara S. Rathore | 2000-10-17 |
| 6130161 | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity | Leon Ashley, Du Nguyen, Hazara S. Rathore, Richard G. Smith | 2000-10-10 |
| 6069068 | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity | Hazara S. Rathore, Paul S. McLaughlin, Du Nguyen, Richard G. Smith, Alexander J. Swinton +1 more | 2000-05-30 |
| 6051273 | Method for forming features upon a substrate | Gene J. Gaudenzi, Frederic Pierre, Georges Robert | 2000-04-18 |
| 6033939 | Method for providing electrically fusible links in copper interconnection | Birendra Agarwala, Du Nguyen, Hazara S. Rathore | 2000-03-07 |
| 5981374 | Sub-half-micron multi-level interconnection structure and process thereof | Du Nguyen, Hazara S. Rathore | 1999-11-09 |