Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596621 | Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate | Bruce Anthony Copeland, Rebecca Y. Gorrell, Mark A. Takacs, Jun Wang, Lovell B. Wiggins | 2003-07-22 |
| 6555912 | Corrosion-resistant electrode structure for integrated circuit decoupling capacitors | Bruce Anthony Copeland, Rebecca Y. Gorrell, Donald W. Scheider, Mark A. Takacs, Peter O. Ulanmo +1 more | 2003-04-29 |
| 6336262 | Process of forming a capacitor with multi-level interconnection technology | Hormazdyar M. Dalal, Gene J. Gaudenzi, Rebecca Y. Gorrell, Mark A. Takacs | 2002-01-08 |
| 5808853 | Capacitor with multi-level interconnection technology | Hormazdyar M. Dalal, Gene J. Gaudenzi, Rebecca Y. Gorrell, Mark A. Takacs | 1998-09-15 |