| 6596621 |
Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate |
Bruce Anthony Copeland, Rebecca Y. Gorrell, Mark A. Takacs, Kenneth J. Travis, Jr., Jun Wang |
2003-07-22 |
| 5950073 |
Self-adjusting semiconductor package stand-offs |
Michael Griffin |
1999-09-07 |
| 5277725 |
Process for fabricating a low dielectric composite substrate |
John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more |
1994-01-11 |
| 5215610 |
Method for fabricating superconductor packages |
Nunzio DiPaolo, Ananda H. Kumar |
1993-06-01 |
| 5139851 |
Low dielectric composite substrate |
John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke +10 more |
1992-08-18 |
| 5135595 |
Process for fabricating a low dielectric composite substrate |
John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more |
1992-08-04 |
