Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840174 | Metallic synapses for neuromorphic and evolvable hardware | Shawn P. Fetterolf, Jin-Ping Han, Christian Lavoie, Ahmet S. Ozcan, Roger QUON | 2020-11-17 |
| 10191108 | On-chip sensor for monitoring active circuits on integrated circuit (IC) chips | Gregory G. Freeman, Siyuranga O. Koswatta, Daniel J. Poindexter, J. Campbell Scott, Scott M. Taylor +2 more | 2019-01-29 |
| 9759766 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Chao-Kun Hu, Baozhen Li | 2017-09-12 |
| 9472477 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Chao-Kun Hu, Baozhen Li | 2016-10-18 |
| 9443776 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore +2 more | 2016-09-13 |
| 9287186 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore +2 more | 2016-03-15 |
| 8922022 | Electromigration resistant via-to-line interconnect | Baozhen Li, Timothy D. Sullivan | 2014-12-30 |
| 8726201 | Method and system to predict a number of electromigration critical elements | Jeanne P. Bickford, Peter A. Habitz, Baozhen Li, Dileep N. Netrabile | 2014-05-13 |
| 8114768 | Electromigration resistant via-to-line interconnect | Baozhen Li, Timothy D. Sullivan | 2012-02-14 |
| 8053257 | Method for prediction of premature dielectric breakdown in a semiconductor | Kaushik Chanda, Hazara S. Rathore, Robert D. Edwards, Lawrence A. Clevenger, Andrew P. Cowley +2 more | 2011-11-08 |
| 7968456 | Method of forming an embedded barrier layer for protection from chemical mechanical polishing process | Sujatha Sankaran, Theodorus E. Standaert | 2011-06-28 |
| 7701035 | Laser fuse structures for high power applications | Stephen E. Greco, Erik L. Hedberg, Dae Young Jung, Christopher D. Muzzy, Norman J. Rohrer +1 more | 2010-04-20 |
| 7692439 | Structure for modeling stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2010-04-06 |
| 7671362 | Test structure for determining optimal seed and liner layer thicknesses for dual damascene processing | Tibor Bolom, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Sujatha Sankaran +3 more | 2010-03-02 |
| 7639032 | Structure for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2009-12-29 |
| 7479447 | Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses | Timothy H. Daubenspeck, Christopher D. Muzzy, Judith A. Wright, Jean Wynne, Dae Young Jung | 2009-01-20 |
| 7439173 | Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via | Stephen E. Greco, Chao-Kun Hu | 2008-10-21 |
| 7397260 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2008-07-08 |
| 7394154 | Embedded barrier for dielectric encapsulation | Sujatha Sankaran, Theodorus E. Standaert | 2008-07-01 |
| 7388224 | Structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore +2 more | 2008-06-17 |
| 7301236 | Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via | Stephen E. Greco, Chao-Kun Hu | 2007-11-27 |
| 7098054 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore +2 more | 2006-08-29 |
| 6995392 | Test structure for locating electromigration voids in dual damascene interconnects | Timothy D. Sullivan, Ping-Chuan Wang | 2006-02-07 |
| 6593660 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Leena Paivikki Buchwalter, Barbara Luther, Paul D. Agnello, John P. Hummel, Terence L. Kane +3 more | 2003-07-15 |
| 6261951 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Leena Paivikki Buchwalter, Barbara Luther, Paul D. Agnello, John P. Hummel, Terence L. Kane +3 more | 2001-07-17 |