Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Conal E. Murray — 88 Patents

IBM: 82 patents #818 of 70,183Top 2%
Globalfoundries: 3 patents #1,029 of 4,424Top 25%
TETessera: 3 patents #129 of 271Top 50%
Yorktown Heights, NY: #30 of 858 inventorsTop 4%
New York: #730 of 115,490 inventorsTop 1%
Overall (All Time): #18,739 of 4,157,543Top 1%
88 Patents All Time
Conal E. Murray has been granted 88 US patents while listed as an inventor at IBM. The first was granted in 2004 and the most recent in March 2024. Conal E. Murray ranks #18,739 of 4,157,543 US inventors in our database (top 0.45%). Patent records list Conal E. Murray in Yorktown Heights, NY, US.

Issued Patents All Time

Showing 1–25 of 88 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11927616 Evaluation of wafer carcass alpha particle emission Michael S. Gordon, Kenneth P. Rodbell 2024-03-12 $11,845,000
11488862 Semiconductor device with reduced via resistance Chih-Chao Yang 2022-11-01 $10,755,000
11222815 Semiconductor device with reduced via resistance Chih-Chao Yang 2022-01-11 $6,150,000
11069567 Modulating metal interconnect surface topography Chih-Chao Yang 2021-07-20 $5,541,000
10903115 Controlling grain boundaries in high aspect-ratio conductive regions Chih-Chao Yang 2021-01-26 $1,788,000
10804147 Semiconductor device with reduced via resistance Chih-Chao Yang 2020-10-13 $5,572,000
10714379 Reducing contact resistance in vias for copper interconnects Chih-Chao Yang 2020-07-14 $4,158,000
10600686 Controlling grain boundaries in high aspect-ratio conductive regions Chih-Chao Yang 2020-03-24 $1,716,000
10553483 Semiconductor device with reduced via resistance Chih-Chao Yang 2020-02-04 $2,135,000
10522398 Modulating metal interconnect surface topography Chih-Chao Yang 2019-12-31 $4,449,000
10468296 Reducing contact resistance in vias for copper interconnects Chih-Chao Yang 2019-11-05 $4,028,000
10446491 Hybrid interconnects and method of forming the same Chih-Chao Yang 2019-10-15 $4,653,000
10424504 Method for forming improved liner layer and semiconductor device including the same Chih-Chao Yang 2019-09-24 $3,094,000
10388615 Activating reactions in integrated circuits through electrical discharge Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell 2019-08-20 $1,949,000
10361115 Reducing contact resistance in vias for copper interconnects Chih-Chao Yang 2019-07-23 $2,519,000
10262955 Activating reactions in integrated circuits through electrical discharge Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell 2019-04-16 $3,839,000
10242943 Forming a stacked capacitor Chih-Chao Yang 2019-03-26 $2,148,000
10170358 Reducing contact resistance in vias for copper interconnects Chih-Chao Yang 2019-01-01
10109586 Semiconductor device interconnect structures formed by metal reflow process Chih-Chao Yang 2018-10-23 $2,704,000
10008421 Capacitance monitoring using x-ray diffraction Donghun Kang, Kriteshwar K. Kohli, Oh-Jung Kwon, Anita Madan 2018-06-26 $3,428,000
9997406 Columnar interconnects and method of making them Chih-Chao Yang 2018-06-12 $1,886,000
9991214 Activating reactions in integrated circuits through electrical discharge Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell 2018-06-05 $4,786,000
9953869 Semiconductor device with reduced via resistance Chih-Chao Yang 2018-04-24 $2,845,000
9929092 Treating copper interconnects Chih-Chao Yang 2018-03-27 $2,459,000
9875959 Forming a stacked capacitor Chih-Chao Yang 2018-01-23 $4,886,000