Issued Patents All Time
Showing 51–75 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8309991 | Nanowire FET having induced radial strain | Sarunya Bangsaruntip, Guy M. Cohen, Jeffrey W. Sleight | 2012-11-13 |
| 8212218 | Dosimeter powered by passive RF absorption | Cyril Cabral, Jr., Michael S. Gordon, Steven J. Koester, Kenneth P. Rodbell, Stephen M. Rossnagel +2 more | 2012-07-03 |
| 8198174 | Air channel interconnects for 3-D integration | Louis Hsu, Brian L. Ji, Fei Liu | 2012-06-12 |
| 8138603 | Redundancy design with electro-migration immunity | Louis L. Hsu, Ping-Chuan Wang, Chih-Chao Yang | 2012-03-20 |
| 7947907 | Electronics structures using a sacrificial multi-layer hardmask scheme | Matthew E. Colburn, Ricardo A. Donaton, Satyanarayana V. Nitta, Sampath Purushothaman, Sujatha Sankaran +2 more | 2011-05-24 |
| 7927895 | Varying capacitance voltage contrast structures to determine defect resistance | Christian Lavoie, Oliver D. Patterson, Robert L. Wisnieff | 2011-04-19 |
| 7923838 | Method and structure for reducing contact resistance between silicide contact and overlying metallization | Christian Lavoie, Kenneth P. Rodbell | 2011-04-12 |
| 7906428 | Modified via bottom structure for reliability enhancement | Lawrence A. Clevenger, Timothy J. Dalton, Louis C. Hsu, Carl Radens, Kwong Hon Wong +1 more | 2011-03-15 |
| 7877716 | Computer program products for determining stopping powers of design structures with respect to a traveling particle | Giovanni Fiorenza, Kenneth P. Rodbell, Henry Tang | 2011-01-25 |
| 7871935 | Non-plasma capping layer for interconnect applications | Chih-Chao Yang | 2011-01-18 |
| 7846834 | Interconnect structure and method for Cu/ultra low k integration | Chih-Chao Yang | 2010-12-07 |
| 7811906 | Carbon-on-insulator substrates by in-place bonding | Ageeth A. Bol, Jack O. Chu, Alfred Grill, Katherine L. Saenger | 2010-10-12 |
| 7786578 | Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure | Christophe Detavenier, Simon Gaudet, Christian Lavoie | 2010-08-31 |
| 7732870 | Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure | Christophe Detavenier, Simon Gaudet, Christian Lavoie | 2010-06-08 |
| 7538029 | Method of room temperature growth of SiOx on silicide as an etch stop layer for metal contact open of semiconductor devices | Yun-Yu Wang, Christian Lavoie, Kevin E. Mello, Matthew Oonk | 2009-05-26 |
| 7491643 | Method and structure for reducing contact resistance between silicide contact and overlying metallization | Christian Lavoie, Kenneth P. Rodbell | 2009-02-17 |
| 7475368 | Deflection analysis system and method for circuit design | Matthew S. Angyal, Giovanni Fiorenza, Habib Hichri, Andrew Lu, Dale Curtis McHerron | 2009-01-06 |
| 7456098 | Building metal pillars in a chip for structure support | Habib Hichri, Xiao Hu Liu, Vincent J. McGahay, Jawahar P. Nayak, Thomas M. Shaw | 2008-11-25 |
| 7446040 | Structure for optimizing fill in semiconductor features deposited by electroplating | Philippe M. Vereecken | 2008-11-04 |
| 7419907 | Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure | Christophe Detavernier, Simon Gaudet, Christian Lavoie | 2008-09-02 |
| 7388224 | Structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Hazara S. Rathore +2 more | 2008-06-17 |
| 7386817 | Method of determining stopping powers of design structures with respect to a traveling particle | Giovanni Fiorenza, Kenneth P. Rodbell, Henry Tang | 2008-06-10 |
| 7371684 | Process for preparing electronics structures using a sacrificial multilayer hardmask scheme | Matthew E. Colburn, Ricardo A. Donaton, Satyanarayana V. Nitta, Sampath Purushothaman, Sujatha Sankaran +2 more | 2008-05-13 |
| 7345305 | Control of liner thickness for improving thermal cycle reliability | Ronald G. Filippi, Lynne M. Gignac, Vincent J. McGahay, Hazara S. Rathore, Thomas M. Shaw +1 more | 2008-03-18 |
| 7298639 | Reprogrammable electrical fuse | Louis C. Hsu, Chandrasekhar Narayan, Chih-Chao Yang | 2007-11-20 |