Issued Patents All Time
Showing 76–88 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7282802 | Modified via bottom structure for reliability enhancement | Lawrence A. Clevenger, Timothy J. Dalton, Louis C. Hsu, Carl Radens, Kwong Hon Wong +1 more | 2007-10-16 |
| 7260810 | Method of extracting properties of back end of line (BEOL) chip architecture | Ronald G. Filippi, Giovanni Fiorenza, Xiao Hu Liu, Gregory A. Northrop, Thomas M. Shaw +2 more | 2007-08-21 |
| 7214548 | Apparatus and method for flattening a warped substrate | Mohammed Fazil Fayaz, Steffen K. Kaldor, Ismail C. Noyan, Anne L. Petrosky | 2007-05-08 |
| 7166913 | Heat dissipation for heat generating element of semiconductor device and related method | Anil K. Chinthakindi, Lawrence A. Clevenger, Tom C. Lee, Gerald Matusiewicz, Chih-Chao Yang | 2007-01-23 |
| 7105817 | Method of forming images in a scanning electron microscope | Lynne M. Gignac, Oliver C. Wells | 2006-09-12 |
| 7098054 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Hazara S. Rathore +2 more | 2006-08-29 |
| 7067902 | Building metal pillars in a chip for structure support | Habib Hichri, Xiao Hu Liu, Vincent J. McGahay, Jawahar P. Nayak, Thomas M. Shaw | 2006-06-27 |
| 6989282 | Control of liner thickness for improving thermal cycle reliability | Ronald G. Filippi, Lynne M. Gignac, Vincent J. McGahay, Hazara S. Rathore, Thomas M. Shaw +1 more | 2006-01-24 |
| 6974531 | Method for electroplating on resistive substrates | Panayotis Andricacos, Hariklia Deligianni, Wilma Jean Horkans, Keith Kwietniak, Michael Lane +4 more | 2005-12-13 |
| 6972209 | Stacked via-stud with improved reliability in copper metallurgy | Birendra Agarwala, Conrad A. Barile, Hormazdyar M. Dalal, Brett H. Engle, Michael Lane +8 more | 2005-12-06 |
| 6812143 | Process of forming copper structures | Michael Lane, Fenton R. McFeely, Robert Rosenberg | 2004-11-02 |
| 6787912 | Barrier material for copper structures | Michael Lane, Fenton R. McFeely, Robert Rosenberg | 2004-09-07 |
| 6768111 | Method for SEM measurement of topological features | Oliver C. Wells, Lynne M. Gignac, Jonathan Rullan | 2004-07-27 |