Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7494915 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Erdem Kaltalioglu +8 more | 2009-02-24 |
| 7378338 | Method of forming an interconnect structure diffusion barrier with high nitrogen content | Cyril Cabral, Jr., Hyungjun Kim, Stephen M. Rossnagel | 2008-05-27 |
| 7241681 | Bilayered metal hardmasks for use in dual damascene etch schemes | Kaushik A. Kumar, Lawrence A. Clevenger, Timothy J. Dalton, Douglas C. La Tulipe, Jr., Andy Cowley +5 more | 2007-07-10 |
| 7241696 | Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer | Larry Clevenger, Timothy J. Dalton, Mark Hoinkis, Kaushik A. Kumar, Douglas C. La Tulipe, Jr. +5 more | 2007-07-10 |
| 7214548 | Apparatus and method for flattening a warped substrate | Mohammed Fazil Fayaz, Conal E. Murray, Ismail C. Noyan, Anne L. Petrosky | 2007-05-08 |
| 7122462 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Erdem Kaltalioglu +8 more | 2006-10-17 |
| 7098537 | Interconnect structure diffusion barrier with high nitrogen content | Cyril Cabral, Jr., Hyungjun Kim, Stephen M. Rossnagel | 2006-08-29 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2006-06-20 |
| 7052621 | Bilayered metal hardmasks for use in Dual Damascene etch schemes | Kaushik A. Kumar, Lawrence A. Clevenger, Timothy J. Dalton, Douglas C. La Tulipe, Jr., Andy Cowley +5 more | 2006-05-30 |
| 7001835 | Crystallographic modification of hard mask properties | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Kaushik A. Kumar +3 more | 2006-02-21 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |