Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176472 | Light-emitting diode packages | Roshan Murthy, Jae Hyung Park, Xiameng Shi | 2024-12-24 |
| 11335833 | Light-emitting diodes, light-emitting diode arrays and related devices | Sung Chul Joo, David Suich, Jae Hyung Park, Arthur Fong-Yuen Pun | 2022-05-17 |
| 11309462 | Semiconductor light emitting devices including superstrates with patterned surfaces | Erin R. F. Welch, Paul T. Fini, Eric Tarsa | 2022-04-19 |
| 11233183 | Light-emitting diodes, light-emitting diode arrays and related devices | David Suich, Arthur Fong-Yuen Pun | 2022-01-25 |
| 11127876 | Method of preventing contamination of LED die | Yue Chau Kwan, Li Ma, Liang Zhang, Bing Li | 2021-09-21 |
| 11121298 | Light-emitting diode packages with individually controllable light-emitting diode chips | Roshan Murthy, Jae Hyung Park, Xiameng Shi | 2021-09-14 |
| 11024785 | Light-emitting diode packages | Roshan Murthy, Jae Hyung Park, Xiameng Shi | 2021-06-01 |
| D902448 | Light emitting diode package | Roshan Murthy, Peter Scott Andrews, Jesse Colin Reiherzer | 2020-11-17 |
| 10522708 | Method of preventing contamination of LED die | Yue Chau Kwan, Li Ma, Liang Zhang, Bing Li | 2019-12-31 |
| 7186166 | Fiber embedded polishing pad | Shyng-Tsong Chen, Oscar K. Hsu, Kenneth P. Rodbell, Jean Vangsness | 2007-03-06 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor +11 more | 2006-06-20 |
| 6989117 | Polishing pads with polymer filled fibrous web, and methods for fabricating and using same | Shyng-Tsong Chen, Kenneth P. Rodbell, Oscar Chi Hsu, Jean Vangsness, David S. Gilbride +1 more | 2006-01-24 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor +11 more | 2005-12-13 |
| 6964604 | Fiber embedded polishing pad | Shyng-Tsong Chen, Oscar K. Hsu, Kenneth P. Rodbell, Jean Vangsness | 2005-11-15 |
| 6911378 | Stabilization of fluorine-containing dielectric materials in a metal insulator wiring structure | Richard A. Conti, John A. Fitzsimmons, David L. Rath, Daewon Yang | 2005-06-28 |
| 6812193 | Slurry for mechanical polishing (CMP) of metals and use thereof | Michael T. Brigham, Donald F. Canaperi, Michael A. Cobb, William J. Cote, Scott A. Estes +9 more | 2004-11-02 |
| 6712681 | Polishing pads with polymer filled fibrous web, and methods for fabricating and using same | Shyng-Tsong Chen, Kenneth P. Rodbell, Oscar K. Hsu, Jean Vangsness, David S. Gilbride +1 more | 2004-03-30 |
| 6685548 | Grooved polishing pads and methods of use | Shyng-Tsong Chen, Kenneth P. Rodbell | 2004-02-03 |
| 6656019 | Grooved polishing pads and methods of use | Shyng-Tsong Chen, Kenneth P. Rodbell | 2003-12-02 |
| 6344414 | Chemical-mechanical polishing system having a bi-material wafer backing film assembly | Fen F. Jamin, Bradley P. Jones, Michael F. Lofaro | 2002-02-05 |
| 6340325 | Polishing pad grooving method and apparatus | Shyng-Tsong Chen, Alex Siu Keung Chung, Oscar K. Hsu, Kenneth P. Rodbell | 2002-01-22 |
| 6325696 | Piezo-actuated CMP carrier | Karl E. Boggs, William Francis Landers, Michael F. Lofaro, Adam D. Ticknor, Ronald D. Fiege | 2001-12-04 |
| 6296717 | Regeneration of chemical mechanical polishing pads in-situ | Adam D. Ticknor, Karl E. Boggs, William Francis Landers, Michael L. Passow | 2001-10-02 |
| 6171513 | Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier | Ralph R. Comulada, Jr., Fen F. Jamin, Bradley P. Jones, Francis R. Krug, Jr., Michael F. Lofaro | 2001-01-09 |
| 6154593 | Optical device and formation of optical waveguide using light-induced effect on refractive index | Kiyotaka Miura, Kazuyuki Hirao | 2000-11-28 |