Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7214623 | Planarization system and method using a carbonate containing fluid | Donald J. Delehanty, James Hannah, Daniel Heenan, Laertis Economikos | 2007-05-08 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Steffen K. Kaldor +11 more | 2006-06-20 |
| 7040966 | Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers | Joseph F. Salfelder, Wayne R. Swart, Gopalakrishna B. Prabhu, Srinivas R. Mirmira, Laertis Economikos +3 more | 2006-05-09 |
| 7041600 | Methods of planarization | Omer H. Dokumaci, Bruce B. Doris, David V. Horak | 2006-05-09 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Steffen K. Kaldor +11 more | 2005-12-13 |
| 6780695 | BiCMOS integration scheme with raised extrinsic base | Huajie Chen, Seshadri Subbanna, Basanth Jagannathan, Gregory G. Freeman, David C. Ahlgren +3 more | 2004-08-24 |
| 6764922 | Method of formation of an oxynitride shallow trench isolation | Klaus D. Beyer, Patrick R. Varekamp | 2004-07-20 |
| 6709951 | Oxynitride shallow trench isolation and method of formation | Klaus D. Beyer, Patrick R. Varekamp | 2004-03-23 |
| 6498383 | Oxynitride shallow trench isolation and method of formation | Klaus D. Beyer, Patrick R. Varekamp | 2002-12-24 |
| 6368969 | Chemical-mechanical polishing methods | Laertis Economikos | 2002-04-09 |
| 6365328 | Semiconductor structure and manufacturing method | Hua Shen, David E. Kotecki, Satish D. Athavale, Jenny Lian, Laertis Economikos +2 more | 2002-04-02 |
| 6344414 | Chemical-mechanical polishing system having a bi-material wafer backing film assembly | Kenneth M. Davis, Bradley P. Jones, Michael F. Lofaro | 2002-02-05 |
| 6264789 | System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer | Sumit Pandey | 2001-07-24 |
| 6225224 | System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer | Sumit Pandey | 2001-05-01 |
| 6171513 | Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier | Kenneth M. Davis, Ralph R. Comulada, Jr., Bradley P. Jones, Francis R. Krug, Jr., Michael F. Lofaro | 2001-01-09 |
| 6149830 | Composition and method for reducing dishing in patterned metal during CMP process | Chienting Lin, Juin-Fang Wang, Ravikumar Ramachandran | 2000-11-21 |