FJ

Fen F. Jamin

IBM: 16 patents #6,952 of 70,183Top 10%
Infineon Technologies Ag: 3 patents #4,439 of 7,486Top 60%
Applied Materials: 1 patents #4,780 of 7,310Top 70%
SA Siemens Aktiengesellschaft: 1 patents #10,653 of 22,248Top 50%
Overall (All Time): #301,663 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7214623 Planarization system and method using a carbonate containing fluid Donald J. Delehanty, James Hannah, Daniel Heenan, Laertis Economikos 2007-05-08
7064064 Copper recess process with application to selective capping and electroless plating Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Steffen K. Kaldor +11 more 2006-06-20
7040966 Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers Joseph F. Salfelder, Wayne R. Swart, Gopalakrishna B. Prabhu, Srinivas R. Mirmira, Laertis Economikos +3 more 2006-05-09
7041600 Methods of planarization Omer H. Dokumaci, Bruce B. Doris, David V. Horak 2006-05-09
6975032 Copper recess process with application to selective capping and electroless plating Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Steffen K. Kaldor +11 more 2005-12-13
6780695 BiCMOS integration scheme with raised extrinsic base Huajie Chen, Seshadri Subbanna, Basanth Jagannathan, Gregory G. Freeman, David C. Ahlgren +3 more 2004-08-24
6764922 Method of formation of an oxynitride shallow trench isolation Klaus D. Beyer, Patrick R. Varekamp 2004-07-20
6709951 Oxynitride shallow trench isolation and method of formation Klaus D. Beyer, Patrick R. Varekamp 2004-03-23
6498383 Oxynitride shallow trench isolation and method of formation Klaus D. Beyer, Patrick R. Varekamp 2002-12-24
6368969 Chemical-mechanical polishing methods Laertis Economikos 2002-04-09
6365328 Semiconductor structure and manufacturing method Hua Shen, David E. Kotecki, Satish D. Athavale, Jenny Lian, Laertis Economikos +2 more 2002-04-02
6344414 Chemical-mechanical polishing system having a bi-material wafer backing film assembly Kenneth M. Davis, Bradley P. Jones, Michael F. Lofaro 2002-02-05
6264789 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer Sumit Pandey 2001-07-24
6225224 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer Sumit Pandey 2001-05-01
6171513 Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier Kenneth M. Davis, Ralph R. Comulada, Jr., Bradley P. Jones, Francis R. Krug, Jr., Michael F. Lofaro 2001-01-09
6149830 Composition and method for reducing dishing in patterned metal during CMP process Chienting Lin, Juin-Fang Wang, Ravikumar Ramachandran 2000-11-21