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2007-05-08 |
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Copper recess process with application to selective capping and electroless plating |
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2006-06-20 |
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Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers |
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2006-05-09 |
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2006-05-09 |
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Copper recess process with application to selective capping and electroless plating |
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BiCMOS integration scheme with raised extrinsic base |
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2004-08-24 |
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Method of formation of an oxynitride shallow trench isolation |
Klaus D. Beyer, Patrick R. Varekamp |
2004-07-20 |
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Oxynitride shallow trench isolation and method of formation |
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2004-03-23 |
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Oxynitride shallow trench isolation and method of formation |
Klaus D. Beyer, Patrick R. Varekamp |
2002-12-24 |
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Chemical-mechanical polishing methods |
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2002-04-09 |
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Semiconductor structure and manufacturing method |
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2002-04-02 |
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Chemical-mechanical polishing system having a bi-material wafer backing film assembly |
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2002-02-05 |
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System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer |
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2001-07-24 |
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System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer |
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2001-05-01 |
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Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier |
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2001-01-09 |
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Composition and method for reducing dishing in patterned metal during CMP process |
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2000-11-21 |