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CMOS structures and methods for improving yield |
Huilong Zhu |
2016-04-19 |
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Method and apparatus for angular high density plasma chemical vapor deposition |
Kangguo Cheng, Pavel Smetana, Richard S. Wise, Keith Kwong Hon Wong |
2015-07-14 |
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Method and apparatus for angular high density plasma chemical vapor deposition |
Kangguo Cheng, Pavel Smetana, Richard S. Wise, Keith Kwong Hon Wong |
2015-04-28 |
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Shallow trench isolation for device including deep trench capacitors |
Sunfei Fang, Oleg Gluschenkov, Byeong Y. Kim, Rishikesh Krishnan |
2014-03-25 |
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Method for controlling structure height |
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2013-10-15 |
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Semiconductor structure |
Kangguo Cheng, Naftali E. Lustig |
2011-10-04 |
| 7943467 |
Structure and method to fabricate MOSFET with short gate |
Huilong Zhu, Brian J. Greene, Yanfeng Wang |
2011-05-17 |
| 7851376 |
Compressive nitride film and method of manufacturing thereof |
Woo-Hyeong Lee, Tai-chi Su, Yun-Yu Wang |
2010-12-14 |
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Method of forming nitride films with high compressive stress for improved PFET device performance |
Richard A. Conti, Ronald P. Bourque, Nancy R. Klymko, Anita Madan, Michael C. Smits +2 more |
2010-09-28 |
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Structure and method for reducing threshold voltage variation |
Huilong Zhu, Yanfeng Wang, Huajie Chen |
2010-07-06 |
| 7615432 |
HDP/PECVD methods of fabricating stress nitride structures for field effect transistors |
Junjung Kim, Jae-Eun Park, Ja-Hum Ku |
2009-11-10 |
| 7563704 |
Method of forming an interconnect including a dielectric cap having a tensile stress |
Chih-Chao Yang, Kaushik Chanda, Lawrence A. Clevenger, Yun-Yu Wang |
2009-07-21 |
| 7521307 |
CMOS structures and methods using self-aligned dual stressed layers |
Huilong Zhu |
2009-04-21 |
| 7521308 |
Dual layer stress liner for MOSFETS |
Deleep R. Nair, Christopher V. Baiocco, Xiangdong Chen, Junjung Kim, Jae-Eun Park |
2009-04-21 |
| 7514370 |
Compressive nitride film and method of manufacturing thereof |
Woo-Hyeong Lee, Tai-chi Su, Yun-Yu Wang |
2009-04-07 |
| 7491660 |
Method of forming nitride films with high compressive stress for improved PFET device performance |
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Method of forming nitride films with high compressive stress for improved PFET device performance |
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2008-12-09 |
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Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same |
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2007-02-20 |
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HDP process for high aspect ratio gap filling |
Michael P. Belyansky, Patricia Argandona, Gregory DiBello, Andreas Knorr |
2005-07-05 |
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Stabilization of fluorine-containing dielectric materials in a metal insulator wiring structure |
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2005-06-28 |