DY

Daewon Yang

IBM: 20 patents #5,451 of 70,183Top 8%
NS Novellus Systems: 2 patents #345 of 780Top 45%
Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #223,719 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9318344 CMOS structures and methods for improving yield Huilong Zhu 2016-04-19
9080239 Method and apparatus for angular high density plasma chemical vapor deposition Kangguo Cheng, Pavel Smetana, Richard S. Wise, Keith Kwong Hon Wong 2015-07-14
9016236 Method and apparatus for angular high density plasma chemical vapor deposition Kangguo Cheng, Pavel Smetana, Richard S. Wise, Keith Kwong Hon Wong 2015-04-28
8679938 Shallow trench isolation for device including deep trench capacitors Sunfei Fang, Oleg Gluschenkov, Byeong Y. Kim, Rishikesh Krishnan 2014-03-25
8557649 Method for controlling structure height Rajasekhar Venigalla, Michael V. Aquilino, Massud Aminpur, Michael P. Belyansky, Unoh Kwon +1 more 2013-10-15
8030707 Semiconductor structure Kangguo Cheng, Naftali E. Lustig 2011-10-04
7943467 Structure and method to fabricate MOSFET with short gate Huilong Zhu, Brian J. Greene, Yanfeng Wang 2011-05-17
7851376 Compressive nitride film and method of manufacturing thereof Woo-Hyeong Lee, Tai-chi Su, Yun-Yu Wang 2010-12-14
7804136 Method of forming nitride films with high compressive stress for improved PFET device performance Richard A. Conti, Ronald P. Bourque, Nancy R. Klymko, Anita Madan, Michael C. Smits +2 more 2010-09-28
7750414 Structure and method for reducing threshold voltage variation Huilong Zhu, Yanfeng Wang, Huajie Chen 2010-07-06
7615432 HDP/PECVD methods of fabricating stress nitride structures for field effect transistors Junjung Kim, Jae-Eun Park, Ja-Hum Ku 2009-11-10
7563704 Method of forming an interconnect including a dielectric cap having a tensile stress Chih-Chao Yang, Kaushik Chanda, Lawrence A. Clevenger, Yun-Yu Wang 2009-07-21
7521307 CMOS structures and methods using self-aligned dual stressed layers Huilong Zhu 2009-04-21
7521308 Dual layer stress liner for MOSFETS Deleep R. Nair, Christopher V. Baiocco, Xiangdong Chen, Junjung Kim, Jae-Eun Park 2009-04-21
7514370 Compressive nitride film and method of manufacturing thereof Woo-Hyeong Lee, Tai-chi Su, Yun-Yu Wang 2009-04-07
7491660 Method of forming nitride films with high compressive stress for improved PFET device performance Richard A. Conti, Ronald P. Bourque, Nancy R. Klymko, Anita Madan, Michael C. Smits +2 more 2009-02-17
7462527 Method of forming nitride films with high compressive stress for improved PFET device performance Richard A. Conti, Ronald P. Bourque, Nancy R. Klymko, Anita Madan, Michael C. Smits +2 more 2008-12-09
7179760 Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same Richard A. Conti, Thomas Houghton, Michael F. Lofaro, Jeffery B. Maxson, Ann McDonald +2 more 2007-02-20
6914015 HDP process for high aspect ratio gap filling Michael P. Belyansky, Patricia Argandona, Gregory DiBello, Andreas Knorr 2005-07-05
6911378 Stabilization of fluorine-containing dielectric materials in a metal insulator wiring structure Richard A. Conti, Kenneth M. Davis, John A. Fitzsimmons, David L. Rath 2005-06-28