AM

Ann McDonald

IBM: 6 patents #16,453 of 70,183Top 25%
Infineon Technologies Ag: 2 patents #3,160 of 7,486Top 45%
Overall (All Time): #873,368 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7179760 Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same Richard A. Conti, Thomas Houghton, Michael F. Lofaro, Jeffery B. Maxson, Yun-Yu Wang +2 more 2007-02-20
7034400 Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors Edward Barth, Glenn A. Biery, Jeffrey P. Gambino, Thomas Ivers, Hyun Koo Lee +2 more 2006-04-25
6939797 Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more 2005-09-06
6914320 Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more 2005-07-05
6887783 Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more 2005-05-03
6737747 Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more 2004-05-18