Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7179760 | Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same | Richard A. Conti, Thomas Houghton, Michael F. Lofaro, Jeffery B. Maxson, Yun-Yu Wang +2 more | 2007-02-20 |
| 7034400 | Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors | Edward Barth, Glenn A. Biery, Jeffrey P. Gambino, Thomas Ivers, Hyun Koo Lee +2 more | 2006-04-25 |
| 6939797 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more | 2005-09-06 |
| 6914320 | Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more | 2005-07-05 |
| 6887783 | Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more | 2005-05-03 |
| 6737747 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more | 2004-05-18 |