Issued Patents All Time
Showing 25 most recent of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278219 | LED chips and devices with textured light-extracting portions, and fabrication methods | David Suich, Kevin Haberern, Justin White | 2025-04-15 |
| 12142711 | Light emitting diodes, components and related methods | Jesse Colin Reiherzer, Amber C. Abare | 2024-11-12 |
| 11894496 | Solid-state light emitting device with improved color emission | Robert Wilcox, Sarah Trinkle, Derek Miller, Colin Blakely | 2024-02-06 |
| 11894488 | LED chips with irregular microtextured light extraction surfaces, and fabrication methods | — | 2024-02-06 |
| 11817526 | Texturing for high density pixelated-LED chips and chip array devices | — | 2023-11-14 |
| 11776938 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Joseph G. Clark, Kevin Haberern | 2023-10-03 |
| 11664407 | Pixelated-LED chips and chip array devices, and fabrication methods | Steven Wuester | 2023-05-30 |
| 11437548 | Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods | — | 2022-09-06 |
| 11417635 | High density pixelated-LED chips and chip array devices | — | 2022-08-16 |
| 11411148 | Light-emitting diode package with light-altering material | Kyle Damborsky, Derek Miller, Jack Vu, Jasper Cabalu, Colin Blakely +1 more | 2022-08-09 |
| 11387221 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Joseph G. Clark, Kevin Haberern | 2022-07-12 |
| 11270897 | Apparatus and methods for mass transfer of electronic die | Christopher P. Hussell | 2022-03-08 |
| 11251164 | Multi-layer conversion material for down conversion in solid state lighting | Fan Zhang, James Ibbetson, Bernd Keller, Thodore Lowes, Antony Paul Van De Ven +2 more | 2022-02-15 |
| 11101411 | Solid-state light emitting devices including light emitting diodes in package structures | Colin Blakely, Jesse Colin Reiherzer, Arthur Fong-Yuen Pun | 2021-08-24 |
| 11004890 | Substrate based light emitter devices, components, and related methods | Sung Chul Joo, Erin R. F. Welch | 2021-05-11 |
| 10991861 | Low optical loss flip chip solid state lighting device | Michael John Bergmann, Matthew Donofrio, Colin Blakely, Troy Gould, Jack Vu | 2021-04-27 |
| 10964858 | Light emitting diodes, components and related methods | Jesse Colin Reiherzer, Amber C. Abare | 2021-03-30 |
| 10962199 | Solid state lighting components | Florin A. Tudorica, Christopher P. Hussell, John W. Durkee, Mark Cash, David N. Randolph | 2021-03-30 |
| 10944031 | Solid state lighting component package with conformal reflective coating | — | 2021-03-09 |
| 10910352 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Joseph G. Clark, Kevin Haberern | 2021-02-02 |
| 10903268 | Pixelated-LED chips and chip array devices, and fabrication methods | Steven Wuester | 2021-01-26 |
| 10903265 | Pixelated-LED chips and chip array devices, and fabrication methods | Steven Wuester | 2021-01-26 |
| 10879435 | Light emitting diodes, components and related methods | Jesse Colin Reiherzer, Amber C. Abare | 2020-12-29 |
| D902448 | Light emitting diode package | Roshan Murthy, Kenneth M. Davis, Jesse Colin Reiherzer | 2020-11-17 |
| 10811573 | Light-emitting diode package with light-altering material | Kyle Damborsky, Derek Miller, Jack Vu, Jasper Cabalu, Colin Blakely +1 more | 2020-10-20 |