| 12278219 |
LED chips and devices with textured light-extracting portions, and fabrication methods |
David Suich, Kevin Haberern, Justin White |
2025-04-15 |
|
| 12142711 |
Light emitting diodes, components and related methods |
Jesse Colin Reiherzer, Amber C. Abare |
2024-11-12 |
|
| 11894496 |
Solid-state light emitting device with improved color emission |
Robert Wilcox, Sarah Trinkle, Derek Miller, Colin Blakely |
2024-02-06 |
|
| 11894488 |
LED chips with irregular microtextured light extraction surfaces, and fabrication methods |
— |
2024-02-06 |
|
| 11817526 |
Texturing for high density pixelated-LED chips and chip array devices |
— |
2023-11-14 |
|
| 11776938 |
High density pixelated LED and devices and methods thereof |
John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Joseph G. Clark, Kevin Haberern |
2023-10-03 |
|
| 11664407 |
Pixelated-LED chips and chip array devices, and fabrication methods |
Steven Wuester |
2023-05-30 |
|
| 11437548 |
Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods |
— |
2022-09-06 |
|
| 11417635 |
High density pixelated-LED chips and chip array devices |
— |
2022-08-16 |
|
| 11411148 |
Light-emitting diode package with light-altering material |
Kyle Damborsky, Derek Miller, Jack Vu, Jasper Cabalu, Colin Blakely +1 more |
2022-08-09 |
|
| 11387221 |
High density pixelated LED and devices and methods thereof |
John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Joseph G. Clark, Kevin Haberern |
2022-07-12 |
|
| 11270897 |
Apparatus and methods for mass transfer of electronic die |
Christopher P. Hussell |
2022-03-08 |
|
| 11251164 |
Multi-layer conversion material for down conversion in solid state lighting |
Fan Zhang, James Ibbetson, Bernd Keller, Thodore Lowes, Antony Paul Van De Ven +2 more |
2022-02-15 |
|
| 11101411 |
Solid-state light emitting devices including light emitting diodes in package structures |
Colin Blakely, Jesse Colin Reiherzer, Arthur Fong-Yuen Pun |
2021-08-24 |
|
| 11004890 |
Substrate based light emitter devices, components, and related methods |
Sung Chul Joo, Erin R. F. Welch |
2021-05-11 |
|
| 10991861 |
Low optical loss flip chip solid state lighting device |
Michael John Bergmann, Matthew Donofrio, Colin Blakely, Troy Gould, Jack Vu |
2021-04-27 |
$147,087,000 |
| 10964858 |
Light emitting diodes, components and related methods |
Jesse Colin Reiherzer, Amber C. Abare |
2021-03-30 |
$56,591,000 |
| 10962199 |
Solid state lighting components |
Florin A. Tudorica, Christopher P. Hussell, John W. Durkee, Mark Cash, David N. Randolph |
2021-03-30 |
$56,591,000 |
| 10944031 |
Solid state lighting component package with conformal reflective coating |
— |
2021-03-09 |
$162,232,000 |
| 10910352 |
High density pixelated LED and devices and methods thereof |
John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Joseph G. Clark, Kevin Haberern |
2021-02-02 |
$81,989,000 |
| 10903268 |
Pixelated-LED chips and chip array devices, and fabrication methods |
Steven Wuester |
2021-01-26 |
$75,655,000 |
| 10903265 |
Pixelated-LED chips and chip array devices, and fabrication methods |
Steven Wuester |
2021-01-26 |
$75,655,000 |
| 10879435 |
Light emitting diodes, components and related methods |
Jesse Colin Reiherzer, Amber C. Abare |
2020-12-29 |
$48,429,000 |
| D902448 |
Light emitting diode package |
Roshan Murthy, Kenneth M. Davis, Jesse Colin Reiherzer |
2020-11-17 |
|
| 10811573 |
Light-emitting diode package with light-altering material |
Kyle Damborsky, Derek Miller, Jack Vu, Jasper Cabalu, Colin Blakely +1 more |
2020-10-20 |
$45,327,000 |