Issued Patents All Time
Showing 25 most recent of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12070875 | Silicon carbide wafers with relaxed positive bow and related methods | Simon Bubel, John Edmond, Ian Currier | 2024-08-27 |
| 11916165 | High voltage monolithic LED chip | Kevin Haberern, Bennett Langsdorf, Thomas Place, Michael John Bergmann | 2024-02-27 |
| 11911842 | Laser-assisted method for parting crystalline material | John Edmond, Harshad Golakia, Eric Mayer | 2024-02-27 |
| 11901181 | Carrier-assisted method for parting crystalline material along laser damage region | John Edmond, Hua-Shuang Kong, Elif Balkas | 2024-02-13 |
| 11826846 | Laser-assisted method for parting crystalline material | John Edmond, Harshad Golakia | 2023-11-28 |
| 11776938 | High density pixelated LED and devices and methods thereof | John Edmond, Jesse Colin Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern | 2023-10-03 |
| 11654596 | Silicon carbide wafers with relaxed positive bow and related methods | Simon Bubel, John Edmond, Ian Currier | 2023-05-23 |
| 11387221 | High density pixelated LED and devices and methods thereof | John Edmond, Jesse Colin Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern | 2022-07-12 |
| 11219966 | Laser-assisted method for parting crystalline material | John Edmond, Harshad Golakia, Eric Mayer | 2022-01-11 |
| 11034056 | Silicon carbide wafers with relaxed positive bow and related methods | Simon Bubel, John Edmond, Ian Currier | 2021-06-15 |
| 11024501 | Carrier-assisted method for parting crystalline material along laser damage region | John Edmond, Hua-Shuang Kong, Elif Balkas | 2021-06-01 |
| 10991861 | Low optical loss flip chip solid state lighting device | Michael John Bergmann, Peter Scott Andrews, Colin Blakely, Troy Gould, Jack Vu | 2021-04-27 |
| 10910352 | High density pixelated LED and devices and methods thereof | John Edmond, Jesse Colin Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern | 2021-02-02 |
| 10797201 | High voltage monolithic LED chip | Kevin Haberern, Bennett Langsdorf, Thomas Place, Michael John Bergmann | 2020-10-06 |
| 10658546 | High efficiency LEDs and methods of manufacturing | Pritish Kar, Sten Heikman, Harshad Golakia, Rajeev Prabhu ACHARYA, Yuvaraj Dora | 2020-05-19 |
| 10611052 | Silicon carbide wafers with relaxed positive bow and related methods | Simon Bubel, John Edmond, Ian Currier | 2020-04-07 |
| 10576585 | Laser-assisted method for parting crystalline material | John Edmond, Harshad Golakia | 2020-03-03 |
| 10562130 | Laser-assisted method for parting crystalline material | John Edmond, Harshad Golakia, Eric Mayer | 2020-02-18 |
| 10529696 | High density pixelated LED and devices and methods thereof | John Edmond, Jesse Colin Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern | 2020-01-07 |
| 10439107 | Chip with integrated phosphor | Sten Heikman, James Ibbetson, Zhimin Jamie Yao, Fan Zhang, Christopher P. Hussell +1 more | 2019-10-08 |
| 10312224 | High density pixelated LED and devices and methods thereof | John Edmond, Jesse Colin Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern | 2019-06-04 |
| 10283681 | Phosphor-converted light emitting device | Brian T. Collins, Kevin Haberern, Bennett Langsdorf, Anoop Mathew, Harry A. Seibel, II +2 more | 2019-05-07 |
| 10135877 | Enforcing usage policies on combinations of collected data to be disseminated to destination systems | David Weinstein, Harleen Sahni, Edward Schuchardt, Vinay Goel, Rafaat Hossain | 2018-11-20 |
| 10115860 | High voltage monolithic LED chip | Kevin Haberern, Bennett Langsdorf, Thomas Place, Michael John Bergmann | 2018-10-30 |
| 10083885 | Multi-layer potting for electronic modules | — | 2018-09-25 |