Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218091 | Superconducting bump bonds for quantum computing systems | Bob Benjamin Buckley | 2025-02-04 |
| 11600588 | Superconducting bump bonds for quantum computing systems | Bob Benjamin Buckley | 2023-03-07 |
| 10439107 | Chip with integrated phosphor | Sten Heikman, James Ibbetson, Fan Zhang, Matthew Donofrio, Christopher P. Hussell +1 more | 2019-10-08 |
| 9391247 | High power LEDs with non-polymer material lenses and methods of making the same | — | 2016-07-12 |
| 9324613 | Method for forming through substrate vias with tethers | John C. Harley | 2016-04-26 |
| 9105824 | High reflective board or substrate for LEDs | Sten Heikman, James Ibbetson, Fan Zhang | 2015-08-11 |
| 8772817 | Electronic device submounts including substrates with thermally conductive vias | — | 2014-07-08 |
| 8643039 | Lateral semiconductor Light Emitting Diodes having large area contacts | Matthew Donofrio, James Ibbetson | 2014-02-04 |
| 8536584 | High voltage wire bond free LEDS | — | 2013-09-17 |
| 8455882 | High efficiency LEDs | — | 2013-06-04 |
| 8368100 | Semiconductor light emitting diodes having reflective structures and methods of fabricating same | Matthew Donofrio, James Ibbetson | 2013-02-05 |
| 8329482 | White-emitting LED chips and method for making same | James Ibbetson | 2012-12-11 |
| 7538032 | Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method | Robert L. Borwick, III, Philip A. Stupar, Jeffrey F. DeNatale, Chailun Tsai, Kathleen Garrett +3 more | 2009-05-26 |
| 6803534 | Membrane for micro-electro-mechanical switch, and methods of making and using it | Shea Chen, Brandon W. Pillans, John Charles Ehmke | 2004-10-12 |
| 6700172 | Method and apparatus for switching high frequency signals | John Charles Ehmke, Charles L. Goldsmith, Susan M. Eshelman | 2004-03-02 |
| 6391675 | Method and apparatus for switching high frequency signals | John Charles Ehmke, Charles L. Goldsmith, Susan M. Eshelman | 2002-05-21 |
| 6147582 | Substrate supported three-dimensional micro-coil | Charles L. Goldsmith, Andrew Malczewski, John Charles Ehmke | 2000-11-14 |