| 11858806 |
Vertical shear weld wafer bonding |
Ivan Kmecko |
2024-01-02 |
$22,861,000 |
| 11835739 |
Dark mirror thin films |
— |
2023-12-05 |
$30,679,000 |
| 11167983 |
Selective wafer removal process for wafer bonding applications |
— |
2021-11-09 |
$35,109,000 |
| 11084717 |
Through-substrate conductor support |
Virgil Ararao |
2021-08-10 |
$40,116,000 |
| 11000915 |
Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of MEMS devices |
Simon Joshua Jacobs |
2021-05-11 |
$37,394,000 |
| 10759658 |
Hermetic vertical shear weld wafer bonding |
Ivan Kmecko |
2020-09-01 |
$30,772,000 |
| 10750645 |
Transparent display panel cooling |
Scott Patrick Overmann, Sean O'Brien |
2020-08-18 |
$31,996,000 |
| 10427932 |
Hermetically sealed MEMS device and its fabrication |
Virgil Ararao |
2019-10-01 |
$30,146,000 |
| 10392246 |
Through-substrate conductor support |
Virgil Ararao |
2019-08-27 |
$25,477,000 |
| 9966194 |
MEMS electrostatic actuator device for RF varactor applications |
Arun Gupta, William C. McDonald, Adam Joseph Fruehling, Ivan Kmecko, Lance W. Barron +2 more |
2018-05-08 |
$24,898,000 |
| 9890036 |
Hermetically sealed MEMS device and its fabrication |
Virgil Ararao |
2018-02-13 |
$15,675,000 |
| 9796585 |
Leak detection using cavity surface quality factor |
— |
2017-10-24 |
$26,140,000 |
| 9567213 |
Hermetically-sealed MEMS device and its fabrication |
Virgil Ararao |
2017-02-14 |
$17,110,000 |
| 9140898 |
Hermetically sealed MEMS device and its fabrication |
Virgil Ararao, Toby Linder, Lance W. Barron |
2015-09-22 |
$9,107,000 |
| 7977208 |
Method and apparatus for packaging circuit devices |
Billy D. Ables, Roland W. Gooch |
2011-07-12 |
$5,292,000 |
| 7867874 |
Method and apparatus for packaging circuit devices |
Billy D. Ables, Roland W. Gooch |
2011-01-11 |
$19,768,000 |
| 7535093 |
Method and apparatus for packaging circuit devices |
Billy D. Ables, Roland W. Gooch |
2009-05-19 |
$39,924,000 |
| 7449765 |
Semiconductor device and method of fabrication |
James Norman Hall |
2008-11-11 |
$7,466,000 |
| 6856014 |
Method for fabricating a lid for a wafer level packaged optical MEMS device |
Vincent C. Lopes, John Harris |
2005-02-15 |
$15,740,000 |
| 6803534 |
Membrane for micro-electro-mechanical switch, and methods of making and using it |
Shea Chen, Brandon W. Pillans, Zhimin Jamie Yao |
2004-10-12 |
$10,738,000 |
| 6700172 |
Method and apparatus for switching high frequency signals |
Charles L. Goldsmith, Zhimin Jamie Yao, Susan M. Eshelman |
2004-03-02 |
$31,367,000 |
| 6633079 |
Wafer level interconnection |
James L. Cheever, Charles L. Goldsmith, Billy D. Ables |
2003-10-14 |
$38,641,000 |
| 6512300 |
Water level interconnection |
James L. Cheever, Charles L. Goldsmith, Billy D. Ables |
2003-01-28 |
$53,375,000 |
| 6501431 |
Method and apparatus for increasing bandwidth of a stripline to slotline transition |
James M. Irion, II, R. Thomas Dover, Richard E. Hodges, Allan R. Logan |
2002-12-31 |
$53,920,000 |
| 6391675 |
Method and apparatus for switching high frequency signals |
Charles L. Goldsmith, Zhimin Jamie Yao, Susan M. Eshelman |
2002-05-21 |
$34,271,000 |
