Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9072164 | Process for fabricating a three dimensional molded feed structure | Alberto F. Viscarra, David T. Winslow, Kurt S. Ketola, Kurt J. Krause, Kevin C. Rolston +2 more | 2015-06-30 |
| 7977208 | Method and apparatus for packaging circuit devices | John Charles Ehmke, Roland W. Gooch | 2011-07-12 |
| 7979144 | System for forming patterns on a multi-curved surface | Sankerlingam Rajendran | 2011-07-12 |
| 7867874 | Method and apparatus for packaging circuit devices | John Charles Ehmke, Roland W. Gooch | 2011-01-11 |
| 7535093 | Method and apparatus for packaging circuit devices | John Charles Ehmke, Roland W. Gooch | 2009-05-19 |
| 6633079 | Wafer level interconnection | James L. Cheever, Charles L. Goldsmith, John Charles Ehmke | 2003-10-14 |
| 6512300 | Water level interconnection | James L. Cheever, Charles L. Goldsmith, John Charles Ehmke | 2003-01-28 |
| 5805426 | Microelectronic assemblies including Z-axis conductive films | Gordon Merritt | 1998-09-08 |