Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12202038 | Device for marking a moulded or cast form | Jennifer Hennessy, Mark Southern | 2025-01-21 |
| 11935810 | Chip warpage reduction via raised free bending and re-entrant (auxetic) trace geometries | David Huitink | 2024-03-19 |
| 11477892 | PCB structure for embedding electronic components | Jennifer Hennessy, Seamus Clifford, Mark Southern | 2022-10-18 |
| 7306975 | Semiconductor wafer cutting blade and method | — | 2007-12-11 |
| 6856014 | Method for fabricating a lid for a wafer level packaged optical MEMS device | John Charles Ehmke, Vincent C. Lopes | 2005-02-15 |