Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935810 | Chip warpage reduction via raised free bending and re-entrant (auxetic) trace geometries | John Harris | 2024-03-19 |
| 11751353 | Power conversion module and method of forming the same | Woochan Kim, Vivek Kishorechand Arora, Hayden Seth Carlton, Fang-Chen Luo, Asif Imran Emon | 2023-09-05 |
| 11071234 | Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling | Bakhtiyar Mohammad Nafis, Reece Whitt | 2021-07-20 |