Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7538032 | Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method | Robert L. Borwick, III, Philip A. Stupar, Jeffrey F. DeNatale, Chailun Tsai, Zhimin Jamie Yao +3 more | 2009-05-26 |