JD

Jeffrey F. DeNatale

TI Teledyne Scientific & Imaging: 28 patents #1 of 186Top 1%
TL Teledyne Licensing: 12 patents #1 of 70Top 2%
RL Rockwell Scientific Licensing: 5 patents #4 of 52Top 8%
RI Rockwell International: 2 patents #464 of 2,155Top 25%
TB The Boeing: 2 patents #5,172 of 15,756Top 35%
CO Coldquanta: 1 patents #21 of 50Top 45%
UF US Air Force: 1 patents #6,190 of 16,312Top 40%
📍 Thousand Oaks, CA: #28 of 1,766 inventorsTop 2%
🗺 California: #7,932 of 386,348 inventorsTop 3%
Overall (All Time): #54,581 of 4,157,543Top 2%
50
Patents All Time

Issued Patents All Time

Showing 1–25 of 50 patents

Patent #TitleCo-InventorsDate
10613319 Compact, high-performance MEMS-based optical shutter Robert Mihailovich, Alex Papavasiliou, Philip A. Stupar, Maximillian A. Perez 2020-04-07
10416246 Physics package for compact atomic device Robert L. Borwick, III, Philip A. Stupar, Viktor Tarashansky 2019-09-17
10325707 Integrated field coil for compact atomic devices Robert L. Borwick, III, Philip A. Stupar, Viktor Tarashansky 2019-06-18
10084035 Vertical capacitor contact arrangement Alexandros P. Papavasiliou, David J. Gulbransen, Alan Roll 2018-09-25
9607748 Micro-fabricated integrated coil and magnetic circuit and method of manufacturing thereof Robert Mihailovich, Alex Papavasiliou, Vivek Mehrotra, Philip A. Stupar, Robert L. Borwick, III +1 more 2017-03-28
9409768 MEMS device with integrated temperature stabilization Philip A. Stupar 2016-08-09
9029259 Self-aligning hybridization method Philip A. Stupar, Yu-Hua Lin, Donald E. Cooper, William E. Tennant 2015-05-12
8995800 Method of fabricating silicon waveguides with embedded active circuitry Philip A. Stupar, Robert L. Borwick, III, Robert Mihailovich 2015-03-31
8937513 Micro-scale system to provide thermal isolation and electrical communication between substrates Philip A. Stupar, Yu-Hua Lin, Robert L. Borwick, III, Alexandros P. Papavasiliou 2015-01-20
8847409 Compliant micro-socket hybridization method Yu-Hua Lin, Philip A. Stupar 2014-09-30
8826514 Microfabricated inductors with through-wafer vias Alexandros P. Papavasiliou, Philip A. Stupar, Robert L. Borwick, III 2014-09-09
8742308 Imaging array device structure with separate charge storage capacitor layer David J. Gulbransen, William E. Tennant, Alexandros P. Papavasiliou 2014-06-03
8654332 Chip-scale optics module for optical interrogators Robert L. Borwick, III 2014-02-18
8505357 Method for adjusting resonance frequencies of a vibrating microelectromechanical device Philip A. Stupar 2013-08-13
8505358 Method for adjusting resonance frequencies of a vibrating microelectromechanical device Philip A. Stupar 2013-08-13
8472098 Manufacturing method for stress compensated X-Y gimbaled MEMS mirror array Chialun Tsai 2013-06-25
8456249 Micro-scale system to provide thermal isolation and electrical communication between substrates Philip A. Stupar, Yu-Hua Lin, Robert L. Borwick, III, Alexandros P. Papavasiliou 2013-06-04
8327684 Method for adjusting resonance frequencies of a vibrating microelectromechanical device Philip A. Stupar 2012-12-11
8319156 System for heating a vapor cell Robert L. Borwick, III, Chialun Tsai, Philip A. Stupar, Ya-Chi Chen 2012-11-27
8211283 Microfabricated liquid junction reference electrode Martin W. Kendig 2012-07-03
8187972 Through-substrate vias with polymer fill and method of fabricating same Philip A. Stupar, Robert L. Borwick, III, Alexandros P. Papavasiliou 2012-05-29
8153062 Analyte detection via electrochemically transported and generated reagent Martin W. Kendig, Chuan-Hua Chen, D. Morgan Tench, Frederick M. Discenzo 2012-04-10
8088667 Method of fabricating vertical capacitors in through-substrate vias Philip A. Stupar, Alexandros P. Papavasiliou, Robert L. Borwick, III 2012-01-03
8080736 Non-planar microcircuit structure and method of fabricating same Philip A. Stupar, Robert L. Borwick, III 2011-12-20
7989915 Vertical electrical device Stefan C. Lauxtermann, Per-Olov Pettersson 2011-08-02