Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837585 | Wafer level packaging of light emitting diodes (LEDs) | Michael John Bergmann, David T. Emerson, Christopher P. Hussell | 2023-12-05 |
| 11776938 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Peter Scott Andrews, Kevin Haberern | 2023-10-03 |
| 11430769 | Tunable integrated optics LED components and methods | Troy Gould, Colin Blakely, Jesse Colin Reiherzer | 2022-08-30 |
| 11424394 | LED package with multiple element light source and encapsulant having curved and/or planar surfaces | Arthur Fong-Yuen Pun, Jeremy Nevins, Jesse Colin Reiherzer | 2022-08-23 |
| 11387221 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Peter Scott Andrews, Kevin Haberern | 2022-07-12 |
| 10910352 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Peter Scott Andrews, Kevin Haberern | 2021-02-02 |
| 10854584 | Wafer level packaging of light emitting diodes (LEDs) | Michael John Bergmann, David T. Emerson, Christopher P. Hussell | 2020-12-01 |
| 10847501 | Tunable integrated optics LED components and methods | Troy Gould, Colin Blakely, Jesse Colin Reiherzer | 2020-11-24 |
| D892066 | LED package | Jesse Colin Reiherzer, Jeremy Nevins | 2020-08-04 |
| 10529696 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Peter Scott Andrews, Kevin Haberern | 2020-01-07 |
| 10468565 | LED package with multiple element light source and encapsulant having curved and/or planar surfaces | Arthur Fong-Yuen Pun, Jeremy Nevins, Jesse Colin Reiherzer | 2019-11-05 |
| 10439112 | Light emitter packages, systems, and methods having improved performance | Jeffrey Carl Britt, Amber C. Abare, Raymond Rosado, Harsh Sundani, David T. Emerson +1 more | 2019-10-08 |
| 10424702 | Compact LED package with reflectivity layer | Jesse Colin Reiherzer, Jeremy Nevins, Michael John Bergmann | 2019-09-24 |
| 10410997 | Tunable integrated optics LED components and methods | Troy Gould, Colin Blakely, Jesse Colin Reiherzer | 2019-09-10 |
| 10361349 | Light emitting diodes, components and related methods | Peter Scott Andrews, Troy Gould, Erin R. F. Welch | 2019-07-23 |
| 10312224 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Peter Scott Andrews, Kevin Haberern | 2019-06-04 |
| D826871 | Light emitting diode device | Jesse Colin Reiherzer, Jeremy Nevins | 2018-08-28 |
| 9897267 | Light emitter components, systems, and related methods | Christopher P. Hussell, Sung Chul Joo, Erin R. F. Welch, Peter Scott Andrews, John Edmond +1 more | 2018-02-20 |
| 9887327 | LED package with encapsulant having curved and planar surfaces | Jesse Colin Reiherzer, Andrew Signor, Michael John Bergmann | 2018-02-06 |
| D790486 | LED package with truncated encapsulant | Jesse Colin Reiherzer, Jeremy Nevins, Michael John Bergmann | 2017-06-27 |
| 9653643 | Wafer level packaging of light emitting diodes (LEDs) | Michael John Bergmann, David T. Emerson, Christopher P. Hussell | 2017-05-16 |
| D783547 | LED package | Michael John Bergmann, Jesse Colin Reiherzer, Benjamin A. Jacobson, Sung Chul Joo | 2017-04-11 |
| D777122 | LED package | Michael John Bergmann, Jesse Colin Reiherzer, Benjamin A. Jacobson, Sung Chul Joo | 2017-01-24 |
| D758976 | LED package | Jesse Colin Reiherzer, Michael John Bergmann | 2016-06-14 |
| 9349929 | Light emitter packages, systems, and methods | Amber C. Abare, David T. Emerson, Jeremy Nevins, Raymond Rosado, Michael John Bergmann | 2016-05-24 |