Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524935 | Filling cavities in an integrated circuit and resulting devices | Sunil Kumar Singh | 2016-12-20 |
| 7884012 | Void-free copper filling of recessed features for semiconductor devices | Kenji Suzuki, Tadahiro Ishizaka, Miho Jomen | 2011-02-08 |
| 7776740 | Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor device | Kenji Suzuki, Miho Jomen | 2010-08-17 |
| 6768111 | Method for SEM measurement of topological features | Oliver C. Wells, Lynne M. Gignac, Conal E. Murray | 2004-07-27 |