Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863189 | Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density | Veeraraghaven S. Basker, John M. Cotte, Hariklia Deligianni, John U. Knickerbocker | 2011-01-04 |
| 7678258 | Void-free damascene copper deposition process and means of monitoring thereof | Panayotis Andricacos, Dean S. Chung, Hariklia Deligianni, James E. Fluegel, Peter S. Locke +4 more | 2010-03-16 |
| 7553400 | Plating apparatus and plating method | Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Ryoichi Kimizuka +4 more | 2009-06-30 |
| 7479213 | Plating method and plating apparatus | Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Hidenao Suzuki +3 more | 2009-01-20 |
| 7227265 | Electroplated copper interconnection structure, process for making and electroplating bath | Panayotis Andricacos, Steven H. Boettcher, Dean S. Chung, Hariklia Deligianni, James E. Fluegel +6 more | 2007-06-05 |
| 7101784 | Method to generate porous organic dielectric | Lawrence A. Clevenger, Stephen E. Greco, Soon-Cheon Seo, Chih-Chao Yang, Yun-Yu Wang +1 more | 2006-09-05 |
| 7060624 | Deep filled vias | Panayotis Andricacos, Emanuel I. Cooper, Timothy J. Dalton, Hariklia Deligianni, Daniel Guidotti +2 more | 2006-06-13 |
| 6974531 | Method for electroplating on resistive substrates | Panayotis Andricacos, Hariklia Deligianni, Wilma Jean Horkans, Michael Lane, Sandra G. Malhotra +4 more | 2005-12-13 |
| 6921978 | Method to generate porous organic dielectric | Lawrence A. Clevenger, Stephen E. Greco, Soon-Cheon Seo, Chih-Chao Yang, Yun-Yu Wang +1 more | 2005-07-26 |
| 6592747 | Method of controlling additives in copper plating baths | Wilma Jean Horkans, Peter S. Locke | 2003-07-15 |
| 6331237 | Method of improving contact reliability for electroplating | Panayotis Andricacos, W. Jean Horkans, Peter S. Locke, Cyprian Emeka Uzoh | 2001-12-18 |
| 6224690 | Flip-Chip interconnections using lead-free solders | Panayotis Andricacos, Madhav Datta, Hariklia Deligianni, Wilma Jean Horkans, Sung Kwon Kang +4 more | 2001-05-01 |
| 5937320 | Barrier layers for electroplated SnPb eutectic solder joints | Panayotis Andricacos, Madhav Datta, Wilma Jean Horkans, Sung Kwon Kang | 1999-08-10 |