RK

Ryoichi Kimizuka

EB Ebara: 10 patents #224 of 1,611Top 15%
EC Ebara-Udylite Co.: 3 patents #1 of 32Top 4%
JC Jcu: 1 patents #5 of 40Top 15%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
OI Omi International: 1 patents #20 of 52Top 40%
IBM: 1 patents #44,794 of 70,183Top 65%
Overall (All Time): #382,634 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
9321741 Copper plating bath containing a tertiary amine compound and use thereof Hiroki Yasuda, Tatsuji Takasu, Takuro Sato, Hiroshi Ishizuka, Yasuhiro Ogo +5 more 2016-04-26
7553400 Plating apparatus and plating method Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Hariklia Deligianni +4 more 2009-06-30
7172683 Method of managing a plating liquid used in a plating apparatus Yasushi Isayama, Hiroyuki Ueyama, Hiroyuki Kaneko, Junitsu Yamakawa, Akihisa Hongo +1 more 2007-02-06
7033463 Substrate plating method and apparatus Akihisa Hongo, Naoaki Ogure, Hiroaki Inoue, Satoshi Sendai, Tetsuma Ikegami +4 more 2006-04-25
6908534 Substrate plating method and apparatus Akihisa Hongo, Mizuki Nagai, Kanji Ohno, Megumi Maruyama 2005-06-21
6811658 Apparatus for forming interconnects Akihisa Hongo, Naoki Matsuda, Kanji Ohno 2004-11-02
6800188 Copper plating bath and plating method for substrate using the copper plating bath Hideki Hagiwara, Yoshitaka Terashima, Megumi Maruyama, Takashi Miyake, Hiroshi Nagasawa +2 more 2004-10-05
6709563 Copper-plating liquid, plating method and plating apparatus Mizuki Nagai, Shuichi Okuyama, Takeshi Kobayashi 2004-03-23
6638411 Method and apparatus for plating substrate with copper Koji Mishima, Mizuki Nagai, Tetsuo Matsuda, Hisashi Kaneko 2003-10-28
6627066 Method of measuring the concentration of a leveler in a plating liquid Yasushi Isayama, Hiroyuki Ueyama, Hiroyuki Kaneko, Junitsu Yamakawa, Akihisa Hongo +1 more 2003-09-30
6517894 Method for plating a first layer on a substrate and a second layer on the first layer Akihisa Hongo, Mizuki Nagai, Kanji Ohno, Megumi Maruyama 2003-02-11
6518182 Via-filling process Masami Ishikawa, Hideki Hagiwara 2003-02-11
4699696 Zinc-nickel alloy electrolyte and process Daniel Combs, Sylvia Martin, Robert A. Tremmel, Kenneth D. Snell, Masaaki Kamitani +1 more 1987-10-13