Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7862402 | Polishing apparatus and substrate processing apparatus | Kenya Ito, Kenji Yamaguchi, Masayuki Nakanishi | 2011-01-04 |
| 7682225 | Polishing apparatus and substrate processing apparatus | Kenya Ito, Kenji Yamaguchi, Masayuki Nakanishi | 2010-03-23 |
| 7297210 | Plating apparatus | Naoki Matsuda, Xinming Wang | 2007-11-20 |
| 7172683 | Method of managing a plating liquid used in a plating apparatus | Yasushi Isayama, Hiroyuki Ueyama, Hiroyuki Kaneko, Junitsu Yamakawa, Ryoichi Kimizuka +1 more | 2007-02-06 |
| 7172979 | Substrate processing apparatus and method | Xinming Wang | 2007-02-06 |
| 7037853 | Wafer cleaning apparatus | Shinya Morisawa | 2006-05-02 |
| 7033463 | Substrate plating method and apparatus | Naoaki Ogure, Hiroaki Inoue, Satoshi Sendai, Tetsuma Ikegami, Koji Mishima +4 more | 2006-04-25 |
| 6929722 | Substrate plating apparatus | Naoaki Ogure, Hiroaki Inoue, Norio Kimura, Fumio Kuriyama, Manabu Tsujimura +2 more | 2005-08-16 |
| 6921466 | Revolution member supporting apparatus and semiconductor substrate processing apparatus | Ichiro Katakabe, Shinya Morisawa | 2005-07-26 |
| 6908534 | Substrate plating method and apparatus | Mizuki Nagai, Kanji Ohno, Ryoichi Kimizuka, Megumi Maruyama | 2005-06-21 |
| 6811658 | Apparatus for forming interconnects | Naoki Matsuda, Kanji Ohno, Ryoichi Kimizuka | 2004-11-02 |
| 6793794 | Substrate plating apparatus and method | Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki +3 more | 2004-09-21 |
| 6730596 | Method of and apparatus for forming interconnection | Akira Fukunaga, Kuniaki Horie, Naoaki Ogure, Takao Kato, Hiroshi Nagasawa | 2004-05-04 |
| 6716330 | Electroless plating apparatus and method | Koji Mishima, Hiroaki Inoue, Norio Kimura, Tsutomu Karimata | 2004-04-06 |
| 6627066 | Method of measuring the concentration of a leveler in a plating liquid | Yasushi Isayama, Hiroyuki Ueyama, Hiroyuki Kaneko, Junitsu Yamakawa, Ryoichi Kimizuka +1 more | 2003-09-30 |
| 6615854 | Wafer cleaning apparatus | Shinya Morisawa | 2003-09-09 |
| 6582580 | Substrate plating apparatus | Kenichi Suzuki, Atsushi Chono | 2003-06-24 |
| 6558518 | Method and apparatus for plating substrate and plating facility | Satoshi Sendai, Kenya Tomioka, Katsumi Tsuda, Masayuki Kumekawa, Naoaki Ogure +1 more | 2003-05-06 |
| 6544585 | Method and apparatus for plating a substrate | Fumio Kuriyama, Hiroaki Inoue, Tsuyoshi Tokuoka | 2003-04-08 |
| 6517894 | Method for plating a first layer on a substrate and a second layer on the first layer | Mizuki Nagai, Kanji Ohno, Ryoichi Kimizuka, Megumi Maruyama | 2003-02-11 |
| 6517689 | Plating device | Kenichi Suzuki, Atsushi Chono, Mitsuo Tada, Akira Ogata, Satoshi Sendai +1 more | 2003-02-11 |
| 6500317 | Plating apparatus for detecting the conductivity between plating contacts on a substrate | Junichiro Yoshioka, Satoshi Sendai, Atsushi Chono, Mitsuo Tada, Yoshitaka Mukaiyama +4 more | 2002-12-31 |
| 6495004 | Substrate plating apparatus | Fumio Kuriyama, Naoaki Ogure | 2002-12-17 |
| 6419462 | Positive displacement type liquid-delivery apparatus | Kuniaki Horie, Yukio Fukunaga, Kiwamu Tsukamoto, Kenji Kamoda, Hirotake Yamagishi +1 more | 2002-07-16 |
| 6365017 | Substrate plating device | Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki +3 more | 2002-04-02 |