Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7241372 | Plating apparatus and plating liquid removing method | Kenya Tomioka, Katsumi Tsuda | 2007-07-10 |
| 7166204 | Plating apparatus and method | Kenya Tomioka, Katsumi Tsuda, Masayuki Kumekawa, Koji Mishima | 2007-01-23 |
| 7033463 | Substrate plating method and apparatus | Akihisa Hongo, Naoaki Ogure, Hiroaki Inoue, Tetsuma Ikegami, Koji Mishima +4 more | 2006-04-25 |
| 6793794 | Substrate plating apparatus and method | Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai +3 more | 2004-09-21 |
| 6689216 | Plating apparatus and plating liquid removing method | Kenya Tomioka, Katsumi Tsuda | 2004-02-10 |
| 6660139 | Plating apparatus and method | Kenya Tomioka, Katsumi Tsuda, Naomitsu Ozawa | 2003-12-09 |
| 6558518 | Method and apparatus for plating substrate and plating facility | Akihisa Hongo, Kenya Tomioka, Katsumi Tsuda, Masayuki Kumekawa, Naoaki Ogure +1 more | 2003-05-06 |
| 6517689 | Plating device | Akihisa Hongo, Kenichi Suzuki, Atsushi Chono, Mitsuo Tada, Akira Ogata +1 more | 2003-02-11 |
| 6500317 | Plating apparatus for detecting the conductivity between plating contacts on a substrate | Junichiro Yoshioka, Atsushi Chono, Mitsuo Tada, Akihisa Hongo, Yoshitaka Mukaiyama +4 more | 2002-12-31 |
| 6365017 | Substrate plating device | Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai +3 more | 2002-04-02 |
| 6365020 | Wafer plating jig | Junichiro Yoshioka, Kenya Tomioka, Atsushi Chono, Naomitsu Ozawa | 2002-04-02 |