AO

Akira Ogata

EB Ebara: 7 patents #319 of 1,611Top 20%
Fujitsu Limited: 1 patents #14,843 of 24,456Top 65%
MC Mcafee: 1 patents #729 of 1,127Top 65%
ND Ntt Docomo: 1 patents #1,030 of 1,706Top 65%
Overall (All Time): #568,501 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10019679 Management apparatus and management method of information processing apparatus Kenichi Shimazaki, Kenichi Mori, Satoshi Matsuda, Kazunao Muramoto, Shinnosuke Nagakura +1 more 2018-07-10
8607344 System, method, and computer program product for initiating a security action at an intermediate layer coupled between a library and an application Davide Libenzi, Katsuaki Yoshizawa, Victor Kouznetsov, Michael Pak, Koichi Asano +1 more 2013-12-10
7341634 Apparatus for and method of processing substrate Toshio Yokoyama, Masahiko Sekimoto, Hiroaki Inoue, Seiji Katsuoka 2008-03-11
RE39262 Polishing apparatus including turntable with polishing surface of different heights Masayoshi Hirose, Yoshimi Sasaki, Seiji Ishikawa, Tamami Takahashi, Hirokuni Hiyama +1 more 2006-09-05
6517689 Plating device Akihisa Hongo, Kenichi Suzuki, Atsushi Chono, Mitsuo Tada, Satoshi Sendai +1 more 2003-02-11
6500317 Plating apparatus for detecting the conductivity between plating contacts on a substrate Junichiro Yoshioka, Satoshi Sendai, Atsushi Chono, Mitsuo Tada, Akihisa Hongo +4 more 2002-12-31
6102786 Polishing apparatus including turntable with polishing surface of different heights Masayoshi Hirose, Yoshimi Sasaki, Seiji Ishikawa, Tamami Takahashi, Hirokuni Hiyama +1 more 2000-08-15
6042454 System for detecting the endpoint of the polishing of a semiconductor wafer by a semiconductor wafer polisher Katsuhide Watanabe, Fumihiko Sakata 2000-03-28
5888126 Polishing apparatus including turntable with polishing surface of different heights Masayoshi Hirose, Yoshimi Sasaki, Seiji Ishikawa, Tamami Takahashi, Hirokuni Hiyama +1 more 1999-03-30