Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865493 | Substrate plating jig | Takashi Murayama | 2018-01-09 |
| 9714476 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Yoshitaka Mukaiyama | 2017-07-25 |
| 9624596 | Electrochemical deposition method | Kuniaki Horie, Yugang Guo, Satoshi Morikami | 2017-04-18 |
| 9593430 | Electrochemical deposition method | Kuniaki Horie, Yugang Guo, Satoshi Morikami | 2017-03-14 |
| 9506162 | Electrochemical deposition method | Kuniaki Horie, Yugang Guo, Satoshi Morikami | 2016-11-29 |
| 9388505 | Electrochemical deposition method | Kuniaki Horie, Yugang Guo, Satoshi Morikami | 2016-07-12 |
| 8961755 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Yoshitaka Mukaiyama | 2015-02-24 |
| 8936705 | Electrochemical deposition apparatus | Kuniaki Horie, Yugang Guo, Satoshi Morikami | 2015-01-20 |
| 8337680 | Substrate holder and plating apparatus | Kuniaki Horie, Yugang Guo, Satoshi Morikami | 2012-12-25 |
| 8133376 | Substrate holder, plating apparatus, and plating method | Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo | 2012-03-13 |
| 8075756 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Yoshitaka Mukaiyama | 2011-12-13 |
| 8012332 | Plating apparatus and method | Nobutoshi Saito, Yoshitaka Mukaiyama, Tsuyoshi Tokuoka | 2011-09-06 |
| 7901551 | Substrate holder and plating apparatus | Kuniaki Horie, Yugang Guo, Satoshi Morikami | 2011-03-08 |
| 7833393 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Yoshitaka Mukaiyama | 2010-11-16 |
| 7807027 | Substrate holder, plating apparatus, and plating method | Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo | 2010-10-05 |
| 7601248 | Substrate holder and plating apparatus | Kuniaki Horie, Yugang Guo, Satoshi Morikami | 2009-10-13 |
| 7402227 | Plating apparatus and method | Nobutoshi Saito, Yoshitaka Mukaiyama, Tsuyoshi Tokuoka | 2008-07-22 |
| 7118664 | Plating method and apparatus | Nobutoshi Saito, Tsuyoshi Tokuoka | 2006-10-10 |
| 7022211 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Yoshitaka Mukaiyama | 2006-04-04 |
| 6844274 | Substrate holder, plating apparatus, and plating method | Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo | 2005-01-18 |
| 6716332 | Plating method and apparatus | Nobutoshi Saito, Tsuyoshi Tokuoka | 2004-04-06 |
| 6569752 | Semiconductor element and fabricating method thereof | Soichi Homma, Masahiro Miyata, Hirokazu Ezawa, Hiroaki Inoue, Tsuyoshi Tokuoka | 2003-05-27 |
| 6500317 | Plating apparatus for detecting the conductivity between plating contacts on a substrate | Satoshi Sendai, Atsushi Chono, Mitsuo Tada, Akihisa Hongo, Yoshitaka Mukaiyama +4 more | 2002-12-31 |
| 6365020 | Wafer plating jig | Kenya Tomioka, Satoshi Sendai, Atsushi Chono, Naomitsu Ozawa | 2002-04-02 |
| 6269548 | Spin processing apparatus | Hiroyuki Shinozaki, Kazuaki Maeda, Akihisa Hongo | 2001-08-07 |