Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673147 | Semiconductor device and manufacturing method thereof | Kenro Nakamura | 2017-06-06 |
| 9396998 | Semiconductor device having fan-in and fan-out redistribution layers | Yoichiro Kurita, Kazushige Kawasaki, Satoshi Tsukiyama | 2016-07-19 |
| 9287225 | Semiconductor device and manufacturing method thereof | Kenro Nakamura | 2016-03-15 |
| 9190373 | Bump structure with underbump metallization structure and integrated redistribution layer | Tatsuo Migita, Soichi Yamashita, Masaya Shima | 2015-11-17 |
| 8703600 | Electronic component and method of connecting with multi-profile bumps | Tatsuo Migita, Soichi Yamashita, Takashi Togasaki | 2014-04-22 |
| 8704367 | Semiconductor device and manufacturing method of semiconductor device | Tatsuo Migita, Soichi Yamashita, Koro Nagamine, Masahiro Miyata, Tatsuo Shiotsuki +1 more | 2014-04-22 |
| 8569181 | Manufacturing method of semiconductor apparatus and semiconductor apparatus | Tatsuo Migita, Tadashi Iijima, Takashi Togasaki | 2013-10-29 |
| 8314491 | Manufacturing method of semiconductor device and semiconductor device | Soichi Yamashita, Tatsuo Migita, Tadashi Iijima, Masahiro Miyata, Masayuki Uchida +1 more | 2012-11-20 |
| 8232197 | Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed | Makoto Honda, Kaori Yomogihara, Kazuhiro Murakami, Masanori Numano, Takahito Nagamatsu +3 more | 2012-07-31 |
| 8063487 | Manufacturing method of semiconductor apparatus and semiconductor apparatus | Tatsuo Migita, Tadashi Iijima, Takashi Togasaki | 2011-11-22 |
| 7638439 | Peripheral processing method and method of manufacturing a semiconductor device | Takeo Kubota, Atsushi Shigeta, Kaori Yomogihara, Makoto Honda | 2009-12-29 |
| 7605076 | Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed | Makoto Honda, Kaori Yomogihara, Kazuhiro Murakami, Masanori Numano, Takahito Nagamatsu +3 more | 2009-10-20 |
| 7531876 | Semiconductor device having power semiconductor elements | Ichiro Omura, Kenji Takahashi, Chiaki Takubo, Hideo Aoki, Hideo Numata +5 more | 2009-05-12 |
| 7473628 | Method of manufacturing semiconductor device and semiconductor device | Masaharu Seto | 2009-01-06 |
| 7399706 | Manufacturing method of semiconductor device | Seiichi Omoto, Tomio Katata, Kazuyuki Higashi, Hitomi Yamaguchi, Atsuko Sakata | 2008-07-15 |
| 7238919 | Heating element movement bonding method for semiconductor components | Hisashi Kaneko, Mie Matsuo | 2007-07-03 |
| 6936302 | Electroless Ni-B plating liquid, electronic device and method for manufacturing the same | Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Masahiro Miyata, Manabu Tsujimura | 2005-08-30 |
| 6798050 | Semiconductor device having semiconductor element with copper pad mounted on wiring substrate and method for fabricating the same | Soichi Homma, Masahiro Miyata | 2004-09-28 |
| 6734568 | Semiconductor device and method of manufacturing the same | Mie Matsuo, Masahiro Miyata | 2004-05-11 |
| 6706422 | Electroless Ni—B plating liquid, electronic device and method for manufacturing the same | Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Masahiro Miyata, Manabu Tsujimura | 2004-03-16 |
| 6661088 | Semiconductor integrated circuit device having interposer and method of manufacturing the same | Takashi Yoda | 2003-12-09 |
| 6605522 | Method of manufacturing a semiconductor device having a protruding bump electrode | Masahiro Miyata | 2003-08-12 |
| 6569752 | Semiconductor element and fabricating method thereof | Soichi Homma, Masahiro Miyata, Junichiro Yoshioka, Hiroaki Inoue, Tsuyoshi Tokuoka | 2003-05-27 |
| RE37882 | Semiconductor device manufacturing method | Masahiro Miyata | 2002-10-15 |
| 6407453 | Semiconductor device and method of manufacturing the same | Tadayoshi Watanabe, Sachiyo Ito, Takamasa Usui, Hisashi Kaneko, Masako Morita | 2002-06-18 |