Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199066 | Semiconductor device and method for producing the same | Gen Toyota, Satoshi Hongo, Susumu Yamamoto, Tsutomu Fujita, Eiichi SHIN +3 more | 2025-01-14 |
| 11929332 | Semiconductor device and manufacturing method thereof | Soichi Homma, Masayuki Miura, Takeori MAEDA, Kazuhiro Kato, Susumu Yamamoto | 2024-03-12 |
| 11398376 | Manufacturing method of a semiconductor device including a support | — | 2022-07-26 |
| 10985006 | Electrolytic plating apparatus | Fumito Shoji, Masahiko Murano | 2021-04-20 |
| 10971400 | Semiconductor device, substrate for semiconductor device and method of manufacturing the semiconductor device | Masahiko Murano, Fumito Shoji, Ippei Kume | 2021-04-06 |
| 10720410 | Semiconductor device and manufacturing method thereof | Koji Ogiso | 2020-07-21 |
| 10312143 | Semiconductor device and method of manufacturing semiconductor device | Koji Ogiso | 2019-06-04 |
| 10115689 | Semiconductor device and method for manufacturing the same | Taku Kamoto, Shinya Watanabe | 2018-10-30 |
| 10115703 | Semiconductor device and manufacturing method thereof | Koji Ogiso | 2018-10-30 |
| 10083893 | Semiconductor device and semiconductor device manufacturing method | Koji Ogiso, Kazuyuki Higashi | 2018-09-25 |
| 9941165 | Semiconductor manufacturing method | Fumito Shoji, Koji Ogiso | 2018-04-10 |
| 9893036 | Semiconductor device and manufacturing method of semiconductor device | Koji Ogiso, Kazuhiro Murakami | 2018-02-13 |
| 9190373 | Bump structure with underbump metallization structure and integrated redistribution layer | Hirokazu Ezawa, Soichi Yamashita, Masaya Shima | 2015-11-17 |
| 8703600 | Electronic component and method of connecting with multi-profile bumps | Hirokazu Ezawa, Soichi Yamashita, Takashi Togasaki | 2014-04-22 |
| 8704367 | Semiconductor device and manufacturing method of semiconductor device | Hirokazu Ezawa, Soichi Yamashita, Koro Nagamine, Masahiro Miyata, Tatsuo Shiotsuki +1 more | 2014-04-22 |
| 8569181 | Manufacturing method of semiconductor apparatus and semiconductor apparatus | Hirokazu Ezawa, Tadashi Iijima, Takashi Togasaki | 2013-10-29 |
| 8314491 | Manufacturing method of semiconductor device and semiconductor device | Soichi Yamashita, Tadashi Iijima, Masahiro Miyata, Masayuki Uchida, Takashi Togasaki +1 more | 2012-11-20 |
| 8063487 | Manufacturing method of semiconductor apparatus and semiconductor apparatus | Hirokazu Ezawa, Tadashi Iijima, Takashi Togasaki | 2011-11-22 |