Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6404051 | Semiconductor device having a protruding bump electrode | Masahiro Miyata | 2002-06-11 |
| 5992725 | Apparatus and method for producing electronic elements | Hidemitsu Egawa | 1999-11-30 |
| 5885891 | Method of manufacturing semiconductor device | Masahiro Miyata | 1999-03-23 |
| 5705230 | Method for filling small holes or covering small recesses in the surface of substrates | Toru Matanabe, Masahiro Miyata, Yukio Ikeda, Manabu Tsujimura, Hiroaki Inoue +2 more | 1998-01-06 |
| 5656542 | Method for manufacturing wiring in groove | Masahiro Miyata, Naoaki Ogure, Manabu Tsujimura, Takeyuki Ohdaira, Hiroaki Inoue +1 more | 1997-08-12 |
| 5587337 | Semiconductor process for forming bump electrodes with tapered sidewalls | Toshiaki Idaka | 1996-12-24 |
| 5529634 | Apparatus and method of manufacturing semiconductor device | Masahiro Miyata, Hidemitsu Egawa, Johta Fukuhara, Shinzi Takeda | 1996-06-25 |
| 5500559 | Semiconductor device and method for manufacturing the same | Masahiro Miyata, Naoaki Ogure, Manabu Tsujimura, Takeyuki Ohdaira, Hiroaki Inoue +1 more | 1996-03-19 |
| 5480839 | Semiconductor device manufacturing method | Masahiro Miyata | 1996-01-02 |
| 5473197 | Semiconductor device having bump electrodes with a trapezoidal cross-section along one axis | Toshiaki Idaka | 1995-12-05 |
| 5136363 | Semiconductor device with bump electrode | Takashi Endo | 1992-08-04 |
| 5057453 | Method for making a semiconductor bump electrode with a skirt | Takashi Endo | 1991-10-15 |