Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7799425 | Composite nanoparticles method for producing the same | Yusuke Chikamori | 2010-09-21 |
| 7033463 | Substrate plating method and apparatus | Akihisa Hongo, Hiroaki Inoue, Satoshi Sendai, Tetsuma Ikegami, Koji Mishima +4 more | 2006-04-25 |
| 6972256 | Method and apparatus for forming thin film of metal | Akira Fukunaga, Kuniaki Horie, Takao Kato, Hiroshi Nagasawa, Shinji Kajita +1 more | 2005-12-06 |
| 6929722 | Substrate plating apparatus | Akihisa Hongo, Hiroaki Inoue, Norio Kimura, Fumio Kuriyama, Manabu Tsujimura +2 more | 2005-08-16 |
| 6921722 | Coating, modification and etching of substrate surface with particle beam irradiation of the same | Kuniaki Horie, Yuji Araki, Hiroshi Nagasaka, Momoko Kakutani, Tohru Satake | 2005-07-26 |
| 6793794 | Substrate plating apparatus and method | Akihisa Hongo, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki +3 more | 2004-09-21 |
| 6787467 | Method of forming embedded copper interconnections and embedded copper interconnection structure | Hiroaki Inoue | 2004-09-07 |
| 6730596 | Method of and apparatus for forming interconnection | Akira Fukunaga, Kuniaki Horie, Takao Kato, Akihisa Hongo, Hiroshi Nagasawa | 2004-05-04 |
| 6709555 | Plating method, interconnection forming method, and apparatus for carrying out those methods | Akira Fukunaga, Hiroshi Nagasawa | 2004-03-23 |
| 6651871 | Substrate coated with a conductive layer and manufacturing method thereof | — | 2003-11-25 |
| 6573201 | Method and apparatus for protection of substrate surface | Hiroaki Inoue | 2003-06-03 |
| 6558518 | Method and apparatus for plating substrate and plating facility | Satoshi Sendai, Akihisa Hongo, Kenya Tomioka, Katsumi Tsuda, Masayuki Kumekawa +1 more | 2003-05-06 |
| 6495004 | Substrate plating apparatus | Fumio Kuriyama, Akihisa Hongo | 2002-12-17 |
| 6486413 | Substrate coated with a conductive layer and manufacturing method thereof | — | 2002-11-26 |
| 6458694 | High energy sputtering method for forming interconnects | Takao Kato, Kuniaki Horie, Yuji Araki | 2002-10-01 |
| 6455475 | Sliding member and process for producing the same | — | 2002-09-24 |
| 6432257 | Dresser for polishing cloth and method for manufacturing such dresser and polishing apparatus | Hiroshi Nagasaka, Momoko Kakutani, Kunio Tateishi, Takashi Yoda | 2002-08-13 |
| 6391775 | Method of forming embedded copper interconnections and embedded copper interconnection structure | Hiroaki Inoue | 2002-05-21 |
| 6387182 | Apparatus and method for processing substrate | Kuniaki Horie, Yukio Fukunaga, Tsutomu Nakada, Masahito Abe, Mitsunao Shibasaki +3 more | 2002-05-14 |
| 6365017 | Substrate plating device | Akihisa Hongo, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki +3 more | 2002-04-02 |
| 6294059 | Substrate plating apparatus | Akihisa Hongo, Hiroaki Inoue, Norio Kimura, Fumio Kuriyama, Manabu Tsujimura +2 more | 2001-09-25 |
| 6147408 | Method of forming embedded copper interconnections and embedded copper interconnection structure | Hiroaki Inoue | 2000-11-14 |
| 6054714 | Electron-beam irradiation apparatus | Masahiro Izutsu | 2000-04-25 |
| 6036783 | Liquid material vaporizer apparatus and gas ejection device | Yukio Fukunaga, Takeshi Murakami, Akihisa Hongo | 2000-03-14 |
| 6005183 | Device containing solar cell panel and storage battery | Yuichi Akai, Yutaka Wada | 1999-12-21 |