MK

Masayuki Kumekawa

EB Ebara: 12 patents #179 of 1,611Top 15%
EI Ebara Technologies Incorporated: 1 patents #7 of 16Top 45%
📍 Fujisawa, CA: #13 of 16 inventorsTop 85%
Overall (All Time): #385,749 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
8133380 Method for regenerating ion exchanger Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Hozumi Yasuda +5 more 2012-03-13
7976362 Substrate polishing apparatus and method Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe +2 more 2011-07-12
7655118 Electrolytic processing apparatus and method Mitsuhiko Shirakashi, Hozumi Yasuda, Itsuki Kobata, Osamu Nabeya 2010-02-02
7638030 Electrolytic processing apparatus and electrolytic processing method Osamu Nabeya, Hozumi Yasuda, Itsuki Kobata, Takeshi Iizumi, Nobuyuki Takada +7 more 2009-12-29
7585205 Substrate polishing apparatus and method Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe +2 more 2009-09-08
7569135 Electrolytic processing apparatus and substrate processing apparatus and method Mitsuhiko Shirakashi, Hozumi Yasuda, Itsuki Kobata, Ikutaro Noji, Kaori Yoshida 2009-08-04
7427345 Method and device for regenerating ion exchanger, and electrolytic processing apparatus Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Hozumi Yasuda +5 more 2008-09-23
7208076 Substrate processing apparatus and method Itsuki Kobata, Mitsuhiko Shirakashi, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki +3 more 2007-04-24
7166204 Plating apparatus and method Satoshi Sendai, Kenya Tomioka, Katsumi Tsuda, Koji Mishima 2007-01-23
7101465 Electrolytic processing device and substrate processing apparatus Itsuki Kobata, Mitsuhiko Shirakashi, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki +3 more 2006-09-05
7083706 Substrate processing apparatus 2006-08-01
6913514 Chemical mechanical polishing endpoint detection system and method Norio Kimura, Huey-Ming Wang 2005-07-05
6558518 Method and apparatus for plating substrate and plating facility Satoshi Sendai, Akihisa Hongo, Kenya Tomioka, Katsumi Tsuda, Naoaki Ogure +1 more 2003-05-06