Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12226825 | Buffer chamber and AM system including a buffer chamber | Hiroyuki Shinozaki, Junki Asai | 2025-02-18 |
| 11891715 | Paddle, processing apparatus having the paddle, and method of producing the paddle | Yasuyuki Masuda, Shao Hua Chang, Masashi Shimoyama, Jumpei Fujikata | 2024-02-06 |
| 11384447 | Substrate holder, plating apparatus, method for manufacturing substrate holder, and method for holding substrate | Matsutaro Miyamoto | 2022-07-12 |
| 11047063 | Plating apparatus and plating method | Jumpei Fujikata, Masashi Shimoyama, Yoichi Nakagawa, Yoshio Minami | 2021-06-29 |
| 11015261 | Substrate holder and plating apparatus | Toshio Yokoyama, Junitsu Yamakawa, Takuya Tsushima, Tomonori Hirao, Sho Tamura +1 more | 2021-05-25 |
| 10665495 | Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device | Toshio Yokoyama, Takuya Tsushima | 2020-05-26 |
| 10577714 | Plating apparatus and plating method | Jumpei Fujikata, Hideharu Aoyama | 2020-03-03 |
| 10294578 | Plating apparatus and plating method | Jumpei Fujikata, Masashi Shimoyama, Yoichi Nakagawa, Yoshio Minami | 2019-05-21 |
| 9714476 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Junichiro Yoshioka | 2017-07-25 |
| 8961755 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Junichiro Yoshioka | 2015-02-24 |
| 8075756 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Junichiro Yoshioka | 2011-12-13 |
| 8012332 | Plating apparatus and method | Junichiro Yoshioka, Nobutoshi Saito, Tsuyoshi Tokuoka | 2011-09-06 |
| 7833393 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Junichiro Yoshioka | 2010-11-16 |
| 7402227 | Plating apparatus and method | Junichiro Yoshioka, Nobutoshi Saito, Tsuyoshi Tokuoka | 2008-07-22 |
| 7022211 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | Junichiro Yoshioka | 2006-04-04 |
| 6500317 | Plating apparatus for detecting the conductivity between plating contacts on a substrate | Junichiro Yoshioka, Satoshi Sendai, Atsushi Chono, Mitsuo Tada, Akihisa Hongo +4 more | 2002-12-31 |