Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191178 | Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus | Yuji Araki, Tensei Sato, Ryuya Koizumi | 2025-01-07 |
| 12116687 | Powder supply apparatus and plating system | Shao Hua Chang | 2024-10-15 |
| 11891715 | Paddle, processing apparatus having the paddle, and method of producing the paddle | Yasuyuki Masuda, Shao Hua Chang, Yoshitaka Mukaiyama, Masashi Shimoyama | 2024-02-06 |
| 11717796 | Paddle, plating apparatus equipped with the paddle, and plating method | Yasuyuki Masuda, Masashi Shimoyama, Yohei Wakuda, Shao Hua Chang | 2023-08-08 |
| 11686647 | Leak check method, leak check apparatus, plating method, and plating apparatus | Kiyoshi Suzuki | 2023-06-27 |
| 11604150 | Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium | Takahisa Okuzono, Masaki Tomita, Hideki Takayanagi | 2023-03-14 |
| 11535949 | Substrate holder and plating apparatus | Masaya Seki, Hideki Takayanagi, Kiyoshi Suzuki, Masayuki Satake | 2022-12-27 |
| 11447885 | Plating method and plating apparatus | Masashi Shimoyama, Ryu Miyamoto, Kentaro Ishimoto | 2022-09-20 |
| 11385125 | Leak check method, leak check apparatus, plating method, and plating apparatus | Kiyoshi Suzuki | 2022-07-12 |
| 11371155 | Method and apparatus for processing a substrate | Takahisa Okuzono | 2022-06-28 |
| 11359304 | Powder supply apparatus and plating system | Shao Hua Chang | 2022-06-14 |
| 11315812 | Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus | Yuji Araki, Tensei Sato, Ryuya Koizumi | 2022-04-26 |
| 11230789 | Method of removing liquid from seal of a substrate holder | Masaya Seki, Hideki Takayanagi, Kiyoshi Suzuki, Masayuki Satake | 2022-01-25 |
| 11047063 | Plating apparatus and plating method | Masashi Shimoyama, Yoichi Nakagawa, Yoshitaka Mukaiyama, Yoshio Minami | 2021-06-29 |
| 10954603 | Substrate holder, plating apparatus, plating method, and electric contact | — | 2021-03-23 |
| 10946351 | Paddle, plating apparatus equipped with the paddle, and plating method | Yasuyuki Masuda, Masashi Shimoyama, Yohei Wakuda, Shao Hua Chang | 2021-03-16 |
| 10914020 | Wave absorbing member attachable to paddle and plating apparatus including wave absorbing member | Shao Hua Chang | 2021-02-09 |
| 10914019 | Plating apparatus and plating method | Shao Hua Chang, Yasuyuki Masuda, Masashi Shimoyama, Tsutomu Nakada | 2021-02-09 |
| 10910334 | Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium | Takahisa Okuzono, Masaki Tomita | 2021-02-02 |
| 10865492 | Plating method and plating apparatus | Masashi Shimoyama, Ryu Miyamoto, Kentaro Ishimoto | 2020-12-15 |
| D892747 | Electrical contact | Kiyoshi Suzuki | 2020-08-11 |
| 10676838 | Plating device, plating method, substrate holder, resistance measuring module, and substrate holder testing method | Mizuki Nagai, Kazuhito Tsuji, Takashi Kishi, Toshiki Miyakawa, Masashi Shimoyama | 2020-06-09 |
| D884650 | Electrical contact | Kiyoshi Suzuki | 2020-05-19 |
| 10641677 | Plating method and plating apparatus | Yoshio Minami, Takashi Kishi | 2020-05-05 |
| 10633757 | Plating apparatus, plating method, and recording medium | Masashi Shimoyama, Yuji Araki, Mizuki Nagai | 2020-04-28 |