RK

Ryuya Koizumi

EB Ebara: 18 patents #107 of 1,611Top 7%
Overall (All Time): #243,187 of 4,157,543Top 6%
18
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12271813 Method for determining optimal number of submodules for use in semiconductor manufacturing apparatus including substrate processing module including plurality of submodules, and semiconductor manufacturing apparatus 2025-04-08
12221714 Plating method and plating apparatus Masashi Shimoyama, Mizuki Nagai 2025-02-11
12191178 Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus Jumpei Fujikata, Yuji Araki, Tensei Sato 2025-01-07
12054841 Apparatus for plating and method of plating Kazuma Ideguchi, Hideki Wakabayashi 2024-08-06
11461647 Method of constructing prediction model that predicts number of plateable substrates, method of constructing selection model for predicting component that causes failure, and method of predicting number of plateable substrates Kunio Oishi, Masashi Shimoyama 2022-10-04
11315812 Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus Jumpei Fujikata, Yuji Araki, Tensei Sato 2022-04-26
11286577 Plating method and plating apparatus Masashi Shimoyama, Mizuki Nagai 2022-03-29
11098414 Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method Takashi Mitsuya, Toshio Yokoyama, Masashi Shimoyama, Kunio Oishi 2021-08-24
11099546 Scheduler, substrate processing apparatus, and substrate conveyance method Koji Nonobe, Takashi Mitsuya, Kunio Oishi 2021-08-24
10824135 Scheduler, substrate processing apparatus, and substrate conveyance method Koji Nonobe, Takashi Mitsuya, Kunio Oishi 2020-11-03
10824138 Scheduler, substrate processing apparatus, and substrate conveyance method Koji Nonobe, Takashi Mitsuya, Kunio Oishi 2020-11-03
10818527 Substrate holding member, substrate processing device, method for controlling substrate processing device, and storage medium storing programs 2020-10-27
10648099 Plating method and plating apparatus Masashi Shimoyama, Mizuki Nagai 2020-05-12
10501862 Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method Takashi Mitsuya, Toshio Yokoyama, Masashi Shimoyama, Kunio Oishi 2019-12-10
10446422 Method of controlling display of operation of semiconductor manufacturing apparatus and non-transitory computer readable storage medium therefor, and system for performing display concerning operation of semiconductor manufacturing apparatus Masayuki Fujiki, Hideharu Aoyama 2019-10-15
10077504 Plating apparatus Yoshio Minami 2018-09-18
9624594 Plating apparatus Yoshio Minami 2017-04-18
8655472 Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus Kunio Oishi, Yoichi Kobayashi 2014-02-18