Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7578886 | Substrate processing apparatus, substrate processing method, and substrate holding apparatus | Kaoru Yamada, Takayuki Saito, Sumio Yabe, Kenya Ito, Masayuki Kamezawa +2 more | 2009-08-25 |
| 7578887 | Apparatus for and method of processing substrate | Shinji Kajita, Haruko Ono, Yuki Inoue, Sachiko Takeda | 2009-08-25 |
| 7309449 | Substrate processing method | Haruko Ono, Sachiko Takeda | 2007-12-18 |
| 6921466 | Revolution member supporting apparatus and semiconductor substrate processing apparatus | Akihisa Hongo, Shinya Morisawa | 2005-07-26 |
| 6776919 | Method and apparatus for etching ruthenium films | Akira Fukunaga, Haruko Ohno, Sachiko Kihara | 2004-08-17 |
| 6745784 | Method of and apparatus for cleaning substrate | Shinya Morisawa, Haruko Ohno, Sachiko Kihara, Akira Fukunaga | 2004-06-08 |
| 6558478 | Method of and apparatus for cleaning substrate | Shinya Morisawa, Haruko Ohno, Sachiko Kihara, Akira Fukunaga | 2003-05-06 |
| 5943578 | Method of manufacturing a semiconductor device having an element isolating region | Naoto Miyashita, Hiroshi Kawamoto | 1999-08-24 |
| 5880032 | Method and apparatus for manufacturing a semiconductor device | Kenji Doi, Naoto Miyashita | 1999-03-09 |
| 5878191 | Heat treatment apparatus for semiconductor wafers | Naoto Miyashita, Hiroshi Kawamoto, Kenji Doi, Tsuyoshi Okuda | 1999-03-02 |
| 5643046 | Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer | Naoto Miyashita, Tatsuo Akiyama | 1997-07-01 |
| 5605488 | Polishing apparatus of semiconductor wafer | Hiroyuki Ohashi, Naoto Miyashita, Tetsuya Tsukihara | 1997-02-25 |